Servers

• Key Features/Applications: Software-defined Storage, In-Memory Computing, Data Intensive HPC, Private & Hybrid Cloud, NVMe Over Fabrics Solution
• CPU: Dual 4th Gen Intel® Xeon® Scalable Processors, up to 32 Cores
• Chassis: 1U
• Drive: Up to 24x E1.S Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM/LRDIMM in 32 DIMM Slots
• Network Ports: 1x RJ45 LAN Ports + Flexible AIOM Option
• Power Supply: 2000W Redundant Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High-Performance Computing, AI / Deep Learning
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 128 Cores
• Chassis: 4U
• Drive: Up to 2x 2.5" Hot-Swap SATA + 4x 2.5" Hot-Swap NVMe Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM/LRDIMM in 24 DIMM Slots
• GPU: Up to 8 Double-Width GPUs
• Power Supply: 4x 2000W Redundant Titanium Level Power Supplies
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Supports NVIDIA RTX PRO™ 6000 Blackwell Max-Q Workstation Edition Graphics Cards

• Key Features/Applications: Enterprise Server, iSCSI SAN, HPC, Data Center, Database Processing & Storage, Corporate Database, Appliance Optimized Storage Building Blocks
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 270W TDP
• Chassis: 2U
• Drive: Up to 12x 3.5" Front Hot-Swap SAS/SATA + 2x 2.5" Hot-Swap SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 1200W Redundant Titanium Level Hot-Plug Power Supplies
• For assistance with RAID configuration, please Contact Us.

• Key Features/Applications: Virtualization, High Performance Computing, Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 2U
• Drive: Up to 8x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays. Supports up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 Double-Width or 8 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Virtualization, High Performance Computing, Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays. Supports up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 1 Double-Width or 3 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing (HPC), VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging, AI Training
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: Full-Tower/5U Rackmount
• Drive: Up to 8x 3.5" Front Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 4 Double-Width or Single-Width GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 2000W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: High Performance Computing, VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 4U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 4x 2700W Redundant (2 + 2) Titanium Level Power Supplies

• Key Features/Applications: Virtualization, Software-defined Storage, AI Inference and Machine Learning, Cloud Computing, Enterprise Server, High Performance Computing (HPC)
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 384 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SATA Drive Bays
• RAM: Up to 9TB of DDR5 ECC RDIMM in 24 DIMM Slots
• Network Ports: 1x 1GbE RJ45 LAN Ports
• Power Supply: 2x 2000W Redundant (1 + 1) Titanium Level Power Supplies

The big savings event is still on! Don't miss your chance to save on select CPUs—Inventory is moving quickly!

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Large Language Model (LLM) Natural Language Processing
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U
• Drive: Up to 8x E1.S Front Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports
• Power Supply: 3x 2000W Redundant Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High-Performance File System, Diskless HPC Clusters, Scale Out All-Flash NVMe Storage, Big Data Analytics and AI
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U / 2 Nodes
• Drive: Up to 12x 2.5" Hot-Swap NVMe/SATA Drive Bays Per Node (2x PCIe 5.0 NVMe/SATA and 10x PCIe 4.0 NVMe/SATA) + 2x M.2 NVMe
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots Per Node
• Cooling: Up to 4 Cooling 16.5K RPM Fans Per 2U Enclosure, Shared Cooling Design Liquid Cooling Support
• Network Ports: Network Connectivity via AIOM (OCP 3.0 Compliant)
• Power Supply: 2x 2200W (1 + 1) Redundant Titanium Level Power Supplies, Shared Power Design

* Complete systems only with all 2 nodes populated.