Servers

• Key Features/Applications: Web Server, Firewall Application, Cloud Computing, Data Center Optimized, Value IaaS, DNS & Gateway Servers, CDN, Edge Nodes
• CPU: Dual 3rd Gen Intel® Xeon® Scalable Processors, up to 40 Cores
• Chassis: 2U
• Drive: Up to 12x 3.5"/2.5" Hot-Swap and Tool-Less NVMe/SATA/SAS + 2x M.2 NVMe Drive Bays
• RAM: Up to 6TB of DDR4 ECC LRDIMM/RDIMM in 16 DIMM Slots
• GPU: Up to 2 Double-Width or 6 Low-Profile GPUs
• Network Ports: 2x AIOM (OCP 3.0) Slots with NCSI
• Power Supply: 1200W Redundant Titanium Level Power Supplies

• Key Features/Applications: Scientific Virtualization, High-Performance Computing, Rendering, AI/Deep Learning Training
• CPU: Dual 3rd Gen Intel® Xeon® Scalable Processors, up to 40 Cores
• Chassis: Full-Tower
• Drive: Up to 8x 3.5" Hot-Swap NVMe/SATA/SAS + 2x M.2 NVMe/SATA Drive Bays
• RAM: Up to 4TB of DDR4 ECC RDIMM/LRDIMM in 16 DIMM Slots
• GPU: Up to 6 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports

• Key Features/Applications: Media/Entertainment Content Creation, Product Design, Engineering Simulation, AI/Deep Learning
• CPU: Single AMD Ryzen™ Threadripper™ PRO 5000WX/3000WX Series Processor, up to 64 Cores
• Chassis: Full Tower
• Drive: Up to 4x 2.5"/3.5" SATA + 2x 2.5" SATA + 4x M.2 NVMe Drive Bays
• RAM: Up to 2TB of DDR4 ECC RDIMM in 8 DIMM Slots
• Network Ports: 1x 10GbE RJ45 LAN Ports
• GPU: Up to 4 GPUs, Support NVIDIA RTX 6000 Ada Generation Graphics Card

• Key Features/Applications: CAD/3D Modeling, 2D/3D Content Creation, VR Content Development
• CPU: Single 12th Gen Intel® Core™ i Processor, up to 24 Cores
• Chassis: Mid-Tower
• Drive: Up to 4x 3.5" SATA + 3x M.2 NVMe Drive Bays. Supports up to 4x 2.5" SATA Drive Bays (Optional)
• RAM: Up to 128GB of DDR5 ECC UDIMM in 4 DIMM Slots
• Network Ports: 1x 1GbE RJ45 + 1x 2.5GbE RJ45 LAN Ports
• Contact Us if you would like to configure your own system

• Key Features/Applications: Data Center Optimized, Network Appliance, Database/Storage, Entry GPU Server
• CPU: Single 5th/4th Gen Intel® Xeon® Scalable Processor, up to 52 Cores
• Chassis: 2U
• Drive: Up to 8x 3.5" Front Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 1 GPU
• Network Ports: 2x 1GbE RJ45 LAN Ports

• Key Features/Applications: 2D/3D Content Creation, VR Content Development
• CPU: Single Intel® Xeon® W-2400 Processor, up to 24 Cores
• Chassis: Mid-Tower
• Drive: Up to 4x 3.5" SATA + 2x M.2 NVMe Drive Bays
• RAM: Up to 1TB of DDR5 ECC RDIMM/LRDIMM in 8 DIMM Slots
• Network Ports: 1x 1GbE RJ45 + 1x 10GbE RJ45 LAN Ports

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High-Performance Computing, Rendering, VDI, AI/Deep Learning Training
• CPU: Dual 3rd Gen Intel® Xeon® Scalable Processors, up to 40 Cores
• Chassis: 4U
• Drive: Up to 24x 2.5" Hot-Swap NVMe/SATA/SAS + 2x M.2 NVMe/SATA Drive Bays
• RAM: Up to 8TB of DDR4 ECC RDIMM/LRDIMM in 32 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 1GbE RJ45 LAN Ports

• Key Features/Applications: Web Server, Firewall Application, Cloud Computing, Compact Server, Data Center Optimized, Value IaaS, DNS & Gateway Servers, CDN, Edge Nodes
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U
• Drive: Up to 12x 3.5"/2.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 2 Double-Width or 6 Single-Width GPUs
• Network Ports: 1x IPMI LAN Port + Flexible AIOM Option

• Key Features/Applications: Product Design and Engineering Simulation
• CPU: Single Intel® Xeon® W-3400 Processor, up to 56 Cores
• Chassis: Full-Tower / 5U Rackmount
• Drive: Up to 4x 3.5" SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM/LRDIMM in 16 DIMM Slots
• GPU: Up to 1 Triple-Width or 4 Double-Width or 6 Single-Width GPUs
• Power Supply: 2000W Redundant Platinum Level Power Supplies
• Network Ports: 1x 10GbE RJ45 LAN Ports

• Key Features/Applications: AI / Deep Learning, High Performance Computing (HPC), Cloud Gaming, Molecular Dynamics Simulation
• CPU: Dual AMD EPYC™ 7003/7002 Series Processors, up to 128 Cores
• Chassis: 4U
• Drive: Up to 24x 2.5" SAS/SATA Drive Bays
• RAM: Up to 8TB of DDR4 ECC RDIMM/LRDIMM in 32 DIMM Slots
• GPU: Up to 8 GPUs
• Power Supply: 2000W (2+2) Redundant Titanium Level Power Supplies
• Network Ports: 2x 1GbE RJ45 LAN Ports