Solutions

• Key Features/Applications: AI / Deep Learning, Visualization / Simulation, 3D Rendering Farm, High Performance Computing, Multimedia/Digital Content Creation
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 192 Cores/500W TDP
• Chassis: 5U
• Drive: Up to 8x 2.5" Front Hot-Swap NVMe + 2x 2.5" Front Hot-Swap SATA Drive Bays + 1x M.2 NVMe Slots
• RAM: Up to 9TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 2700W (3 + 3) Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: AI / Deep Learning, VDI, Design & Visualization, 3D Rendering, High Performance Computing, Media/Video Streaming, Cloud Gaming, Diagnostic Imaging
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 5U
• Drive: Up to 24x 2.5" Front Hot-Swap PCIe 5.0 NVMe Drive Bays + 2x M.2 NVMe Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 2700W Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging
• CPU: Dual 4th Gen Intel® Xeon® Scalable Processors, up to 60 Cores
• Chassis: 5U
• Drive: Up to 24x 2.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 8TB of DDR5 ECC DRAM in 32 DIMM Slots
• GPU: Up to 10 GPUs
• Power Supply: 4x 2700W (2+2) Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Digital-twins, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics, Edge AI Inferencing
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 3U
• Drive: Up to 14x E1.S Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional) or 6x 2.5" Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots (1 DIMM per channel)
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 3x 3200W/2700W Redundant (2 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL, L40S GPU Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Multi-Access Edge Computing (MEC), Industrial Automation, Machine Learning (ML), Universal Customer Premise Equipment (uCPE), Artificial Intelligence at the Edge, Smart Retail, Medical Expert Systems
• CPU: Single 5th/4th Gen Intel® Xeon® Scalable Processors, up to 32 Cores
• Chassis: Fan-based Embedded
• Drive: Up to 2x 2.5" Front Hot-Swap NVMe + 2x 2.5" Internal Fixed SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 3DS ECC RDIMM in 8 DIMM Slots
• GPU: Up to 2x GPUs Single-Width or 1x GPU Double-Width (up to 350W)
• Network Ports: 2x 10GbE RJ45 LAN Ports

Lot 9 Compliance Notice: This product is exempt from Lot 9 requirements in accordance with relevant regulations. Before purchasing, please ensure the equipment type or your intended use for this product aligns with the Lot 9 exemption criteria.

Please find the details here.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 72 Cores
• Chassis: 4U
• Drive: Up to 8x E1.S Front Hot-Swap NVMe Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM (6400MT/s) or ECC MRDIMM (8800MT/s) in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GBASE-T RJ45 LAN Ports
• Power Supply: 4x 3200W Redundant (3 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Generative AI, AI Inference, Model Training, 3D Graphics and Video Rendering, Cloud Gaming
• CPU: Single AMD EPYC™ 4005/4004 Series Processor Per Node, up to 16 Cores
• Chassis: 3U / 5 Nodes
• Drive: Up to 2x 2.5" Internal Fixed PCIe 5.0 NVMe + 2x 2.5" Internal Fixed SATA Drive Bays Per Node
• RAM: Up to 192GB of DDR5 ECC/non-ECC UDIMM in 4 DIMM Slots Per Node
• GPU: Up to 2 GPUs Per Node
• Network Ports: Flexible Networking Options with PCIe 5.0 MicroLP Interfaces
• Power Supply: 4x 2000W Redundant (3 + 1) Titanium Level Shared Power Supply

* Complete systems only with all 5 nodes populated.

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Telecom Micro Data Center, AI Inference and Machine Learning, Cloud Computing, Network Function Virtualization (NFV), 5G Networking
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processor, up to 64 Cores
• Chassis: 2U
• Drive: Up to 6x 2.5" Front Hot-Swap NVMe/SATA Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 Double-Width GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Networking Slots (OCP NIC 3.0 Compatible)
• Power Supply: 2x 2000W Redundant Titanium Level AC Power Supplies

• Key Features/Applications: Storage Hardware for IaaS
• CPU: Single AMD EPYC™ 9455P Processor, 48 Cores
• Chassis: 2U
• Drive: 8x 24TB 3.5" SATA + 2x 3.8TB U.2 NVMe + 2x 240GB 2.5" SATA SSD
• RAM: 12x 64GB DDR5-6400 RDIMM Memory
• Network Ports: 2x 25GbE SFP28 LAN Ports (Broadcom 57414)
• Power Supply: 2x 1200W Redundant (1 + 1) Titanium Level Power Supplies
• Need more customization? Explore the configurable AS -2015CS-TNR system.

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.