High Performance Computing (HPC)

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Digital-twins, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics, Edge AI Inferencing
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 3U
• Drive: Up to 14x E1.S Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional) or 6x 2.5" Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots (1 DIMM per channel)
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 3x 3200W/2700W Redundant (2 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL, L40S GPU Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Best for: Web Application/Storage
• Key Features/Applications: HPC, Cloud Gaming, Telco Edge, MEC (Multi-Access Edge Computing), Multi-Purpose CDN, High-availability Cache Cluster, EDA (Electric Design Automation), Mission Critical Web Applications
• CPU: Single AMD EPYC™ 9534 Processor Per Node, 64 Cores
• Chassis: 2U / 4 Nodes
• Drive: 1x 960GB 2.5" SATA SSD Per Node
• RAM: 8x 64GB DDR5 4800MHz RDIMM Memory Per Node
• Network Ports: 2x 100GbE QSFP28 LAN Ports Per Node
• Power Supply: 2x 2200W Redundant Titanium Level Shared Power Supplies
• Pre-Configured 2U 4-Node GrandTwin System for Web Application/Storage. View Datasheet

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.