Servers

• Key Features/Applications: Software-defined Storage, In-Memory Computing, Data Intensive HPC, Private & Hybrid Cloud, NVMe Over Fabrics Solution
• CPU: Dual 4th Gen Intel® Xeon® Scalable Processors, up to 32 Cores
• Chassis: 1U
• Drive: Up to 24x E1.S Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM/LRDIMM in 32 DIMM Slots
• Network Ports: 1x RJ45 LAN Ports + Flexible AIOM Option
• Power Supply: 2000W Redundant Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, Software-defined Storage, AI Inference and Machine Learning, Cloud Computing, Enterprise Server, High Performance Computing (HPC)
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 384 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SATA Drive Bays
• RAM: Up to 9TB of DDR5 ECC RDIMM in 24 DIMM Slots
• Network Ports: 1x 1GbE RJ45 LAN Ports
• Power Supply: 2x 2000W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Large Language Model (LLM) Natural Language Processing
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U
• Drive: Up to 8x E1.S Front Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports
• Power Supply: 3x 2000W Redundant Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Digital-twins, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics, Edge AI Inferencing
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 3U
• Drive: Up to 14x E1.S Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional) or 6x 2.5" Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots (1 DIMM per channel)
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 3x 3200W/2700W Redundant (2 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL, L40S GPU Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Enterprise Server, iSCSI SAN, HPC, Data Center, Database Processing & Storage, Corporate Database, Appliance Optimized Storage Building Blocks
• CPU: Single 5th/4th Gen Intel® Xeon® Scalable Processor, up to 36 Cores
• Chassis: 2U
• Drive: Up to 24x 3.5" Hot-Swap SAS/SATA + 2x 2.5" Hot-Swap SATA Drive Bays. Supports up to 24x 3.5" Hot-Swap SAS/SATA + 6x 2.5" Hot-Swap NVMe/SATA Drive Bays (Optional)
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 2x 1600W Redundant Titanium Level Power Supply

• Key Features/Applications: Enterprise Server, iSCSI SAN, HPC, Data Center, Database Processing & Storage, Corporate Database, Appliance Optimized Storage Building Blocks
• CPU: Single AMD EPYC™ 9005/9004 Series Processor, up to 84 Cores
• Chassis: 2U
• Drive: Up to 24x 3.5" Hot-Swap SAS/SATA + 2x 2.5" Hot-Swap SATA Drive Bays. Supports up to 24x 3.5" Hot-Swap SAS/SATA + 6x 2.5" Hot-Swap NVMe/SATA Drive Bays (Optional)
• RAM: Up to 3TB (AMD EPYC™ 9004 Series Processor)/ 4.5TB (AMD EPYC™ 9005 Series Processor) of DDR5 ECC RDIMM in 12 DIMM Slots
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 1x 1600W Titanium Level Power Supply

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 72 Cores
• Chassis: 4U
• Drive: Up to 8x E1.S Front Hot-Swap NVMe Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM (6400MT/s) or ECC MRDIMM (8800MT/s) in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GBASE-T RJ45 LAN Ports
• Power Supply: 4x 3200W Redundant (3 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1000W/1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC