Data Center

• Key Features/Applications: Virtualization, Financial, Scale Out All-Flash NVMe Storage, Cloud Computing, Data Center Enterprise Applications, AI Inference, CDN/vCDN/Cloud CDN
• CPU: Single Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe*/SAS/SATA Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 1 Double-Width or 2 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies

* Intel Xeon 6700E-series only support 8 NVMe.

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, AI Inference and Machine Learning, Software-defined Storage, Cloud Computing, Data Center Optimized, AI Inference, Database Processing and High Density Storage
• CPU: Single Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe*/SAS/SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 1 Double-Width or 2 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies

* Intel Xeon 6700E-series only support 8 NVMe.

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Big Data & Analytics, Data Lake, Telco & Cloud Service Providers, Content Repositories, HPC and AI/ML Workloads, Financial Services & Healthcare Image Archives, Government Data Protection
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 144 Cores
• Chassis: 4U
• Drive: Up to 90x 3.5"/2.5" Top-Loading Hot-Swap SAS/SATA + 4x 2.5" Rear Hot-Swap NVMe + 2x 2.5" Fixed Internal NVMe Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: Flexible Networking Options
• Power Supply: 2x 2600W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Networking Appliance, General Purpose Computing, Web Server, Firewall Application, Data Center Optimized, Entry-Level System for SOHO and SMB, Entry GPU Server
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 8x 3.5" Front Hot-Swap SATA Drive Bays (Optional support for 4x 2.5" PCIe 5.0 NVMe/SAS/SATA + 4x 3.5"/2.5" SAS/SATA Drive Bays)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 1 GPU
• Network Ports: 2x 1GbE RJ45 LAN Ports
• Power Supply: 2x 1000W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1000W/1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Virtualization, HPC, CDN, Edge Nodes, Cloud Computing, Data Center Optimized, Storage Headnode
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap PCIe 5.0 NVMe/SAS/SATA Drive Bays + 4x 2.5" PCIe 5.0 SAS/SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: Flexible Networking Options with 2 PCIe 5.0 slots + 1 AIOM Networking Slot
• Power Supply: 2x 1000W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) with Flexible I/O and Storage Configurations
• Based on Modular Scalable DeNsity Optimized HPM Form Factor (M-SDNO)
• Supports DC-SCM module with OpenBMC