High Performance Computing (HPC)

• Key Features/Applications: Software-defined Storage, In-Memory Computing, Data Intensive HPC, Private & Hybrid Cloud, NVMe Over Fabrics Solution
• CPU: Dual 4th Gen Intel® Xeon® Scalable Processors, up to 32 Cores
• Chassis: 1U
• Drive: Up to 24x E1.S Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM/LRDIMM in 32 DIMM Slots
• Network Ports: 1x RJ45 LAN Ports + Flexible AIOM Option
• Power Supply: 2000W Redundant Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, High Performance Computing, Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 2U
• Drive: Up to 8x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays. Supports up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 Double-Width or 8 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Virtualization, High Performance Computing, Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays. Supports up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 1 Double-Width or 3 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, Software-defined Storage, AI Inference and Machine Learning, Cloud Computing, Enterprise Server, High Performance Computing (HPC)
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 384 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SATA Drive Bays
• RAM: Up to 9TB of DDR5 ECC RDIMM in 24 DIMM Slots
• Network Ports: 1x 1GbE RJ45 LAN Ports
• Power Supply: 2x 2000W Redundant (1 + 1) Titanium Level Power Supplies

The big savings event is still on! Don't miss your chance to save on select CPUs—Inventory is moving quickly!

• Key Features/Applications: Virtualization, AI Inference and Machine Learning, Software-defined Storage, Cloud Computing, Data Center Optimized, AI Inference, Database Processing and High Density Storage
• CPU: Single Intel® Xeon® 6 6521P Processor, 24 Cores
• Chassis: 2U
• Drive: 1x 960GB M.2 NVMe SSD
• RAM: 1x 32GB DDR5-6400 ECC RDIMM Memory
• Network Ports: 2x 10GbE RJ45 LAN Ports via AIOM
• Need more customization? Explore the configurable SYS-212H-TN system.

• Key Features/Applications: Virtualization, AI Inferencing & Machine Learning, Enterprise Server, Software-Defined Storage, Cloud Computing, High Performance Computing (HPC)
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SATA Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• Network Ports: Flexible Networking Options with 1 AIOM Networking Slot (OCP NIC 3.0 compatible)
• Power Supply: 2x 1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies