High Performance Computing (HPC)

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Large Language Model (LLM) Natural Language Processing
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U
• Drive: Up to 8x E1.S Front Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports
• Power Supply: 3x 2000W Redundant Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Enterprise AI, Chatbot/RAG, Document Processing, Content Creation, Recommendation, Synthetic Data Generation, Agentic AI, HPC, CAD/CAE/CFD, Scientific Research (Modular Dynamics, Weather Forecast, Geological Analysis)
• CPU: Single Intel® Xeon® 6731P Processor, 32 Cores
• Chassis: 2U
• Drive: 1x 960GB M.2 PCIe Gen 4.0 NVMe + 2x 3.84TB E1.S PCIe Gen 5.0 NVMe SSD
• RAM: 8x 64GB DDR5-6400 RDIMM Memory
• GPU: 2x NVIDIA RTX PRO™ 6000 Blackwell Server Edition GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports (Broadcom 57416)
• Power Supply: 2x 2700W Redundant Titanium Level Power Supplies
• Pre-Configured Agent Flow AI Inferencing System (SaaS) View Datasheet

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Artificial Intelligence, Virtualization, High Performance Computing, Data Analytics
• CPU: Dual Intel® Xeon® 6 6900 Series Processor, up to 128 Cores (P-cores)/288 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM (P-core only) or 3TB of DDR5 ECC RDIMM (E-core) in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: Flexible Networking Options with 2 AIOM Slots (OCP NIC 3.0 compatible)
• Power Supply: 2x 1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Scientific Research, Model analysis, High-Performance Computing (HPC), Research Lab, Financial Services, Edge AI
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores, up to 80 Cores
• Chassis: 2U
• Drive: Up to 4x E1.S Rear Hot-Swap NVMe Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM (2DPC) or 512GB MRDIMM in 16 DIMM Slots
• GPU: Up to 4x Double-Width GPUs
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 2x 2700W Redundant Titanium Level Power Supplies
• Cost-Effective 2U Xeon® 6700 Server Supporting up to 4x H200 or RTX PRO 6000 BSE GPUs at 35°C Ambient Temperature
• Need it ASAP? Shop our Ready-to-Deploy Gold Series Configuration: SYS-212GB-FNR-01-G2.