High Performance Computing (HPC)

• Key Features/Applications: Enterprise Server, iSCSI SAN, HPC, Data Center, Database Processing & Storage, Corporate Database, Appliance Optimized Storage Building Blocks
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 270W TDP
• Chassis: 4U
• Drive: Up to 36x 3.5" Hot-Swap SAS/SATA + 2x 2.5" Hot-Swap SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 1600W Redundant Titanium Level Hot-Plug Power Supplies
• For assistance with RAID configuration, please Contact Us.

• Key Features/Applications: Enterprise Server, iSCSI SAN, HPC, Data Center, Database Processing & Storage, Corporate Database, Appliance Optimized Storage Building Blocks
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 270W TDP
• Chassis: 2U
• Drive: Up to 12x 3.5" Front Hot-Swap SAS/SATA + 2x 2.5" Hot-Swap SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 1200W Redundant Titanium Level Hot-Plug Power Supplies
• For assistance with RAID configuration, please Contact Us.

• Key Features/Applications: High-Performance File System, Diskless HPC Clusters, Scale Out All-Flash NVMe Storage, Big Data Analytics and AI
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U / 2 Nodes
• Drive: Up to 12x 2.5" Hot-Swap NVMe/SATA Drive Bays Per Node (2x PCIe 5.0 NVMe/SATA and 10x PCIe 4.0 NVMe/SATA) + 2x M.2 NVMe
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots Per Node
• Cooling: Up to 4 Cooling 16.5K RPM Fans Per 2U Enclosure, Shared Cooling Design Liquid Cooling Support
• Network Ports: Network Connectivity via AIOM (OCP 3.0 Compliant)
• Power Supply: 2x 2200W (1 + 1) Redundant Titanium Level Power Supplies, Shared Power Design

* Complete systems only with all 2 nodes populated.

• Key Features/Applications: High Performance Computing (HPC), AI/Deep Learning Training, Machine Learning (ML), Climate and Weather Modeling, Database Processing and High Density Storage, Industrial Automation Retail, Data Center
• CPU: Dual AMD EPYC™ 9575F Processors, 64 Cores
• Chassis: 8U
• Drive: 1x 960GB U.2 NVMe SSD + 4x 3.8TB U.3 NVMe SSD
• RAM: 24x 96GB DDR5-6400 ECC RDIMM Memory
• GPU: 8x AMD Instinct™ MI325X Onboard OAM GPUs
• Network Ports: 8x Single Port 400GbE QSFP112 Ports
• Power Supply: 6x 5250W Redundant (3 + 3) Titanium Level Power Supplies
• Pre-Configured AMD Instinct™ MI325X 8-GPU System

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.