Servers

• Key Features/Applications: Virtualization, High Performance Computing, Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 2U
• Drive: Up to 8x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays. Supports up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 Double-Width or 8 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, High Performance Computing, Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays. Supports up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 1 Double-Width or 3 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing (HPC), VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging, AI Training
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: Full-Tower/5U Rackmount
• Drive: Up to 8x 3.5" Front Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 4 Double-Width or Single-Width GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 2000W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Virtualization, Software-defined Storage, AI Inference and Machine Learning, Cloud Computing, Enterprise Server, High Performance Computing (HPC)
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 384 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SATA Drive Bays
• RAM: Up to 9TB of DDR5 ECC RDIMM in 24 DIMM Slots
• Network Ports: 1x 1GbE RJ45 LAN Ports
• Power Supply: 2x 2000W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Large Language Model (LLM) Natural Language Processing
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U
• Drive: Up to 8x E1.S Front Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports
• Power Supply: 3x 2000W Redundant Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, AI Inferencing & Machine Learning, Enterprise Server, Software-Defined Storage, Cloud Computing, High Performance Computing (HPC)
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SATA Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• Network Ports: Flexible Networking Options with 1 AIOM Networking Slot (OCP NIC 3.0 compatible)
• Power Supply: 2x 1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Climate and Weather Modeling
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 160 Cores
• Chassis: 8U
• Drive: Up to 18x 2.5" Front Hot-Swap NVMe/SATA Drive Bays + 2x M.2 NVMe (M-Key) Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 6x 3000W Redundant (3 + 3) Titanium Level Power Supplies
• Supports AMD Instinct™ MI300X Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 72 Cores
• Chassis: 4U
• Drive: Up to 8x E1.S Front Hot-Swap NVMe Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM (6400MT/s) or ECC MRDIMM (8800MT/s) in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GBASE-T RJ45 LAN Ports
• Power Supply: 4x 3200W Redundant (3 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1000W/1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC