Rackmount Servers

• Key Features/Applications: High-Performance Computing, AI / Deep Learning
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 128 Cores
• Chassis: 4U
• Drive: Up to 2x 2.5" Hot-Swap SATA + 4x 2.5" Hot-Swap NVMe Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM/LRDIMM in 24 DIMM Slots
• GPU: Up to 8 Double-Width GPUs
• Power Supply: 4x 2000W Redundant Titanium Level Power Supplies
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Supports NVIDIA RTX PRO™ 6000 Blackwell Max-Q Workstation Edition Graphics Cards

• Key Features/Applications: Virtualization, AI Inferencing & Machine Learning, Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 256 Cores
• Chassis: 2U
• Drive: Up to 12x 3.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1600W Redundant Titanium Level Power Supplies

• Key Features/Applications: Virtualization, Financial, Scale Out All-Flash NVMe Storage, Cloud Computing, Data Center Enterprise Applications, AI Inference, CDN/vCDN/Cloud CDN
• CPU: Single Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe*/SAS/SATA Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 1 Double-Width or 2 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies

* Intel Xeon 6700E-series only support 8 NVMe.

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, AI Inference and Machine Learning, Software-defined Storage, Cloud Computing, Data Center Optimized, AI Inference, Database Processing and High Density Storage
• CPU: Single Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe*/SAS/SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 1 Double-Width or 2 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• Need it ASAP? Shop our Ready-to-Deploy Gold Series Configuration: SYS-212H-TN-G1.

* Intel Xeon 6700E-series only support 8 NVMe.

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Deep Learning/AI/Machine Learning Development, Cloud Gaming, Rack Workstation
• CPU: Single AMD Ryzen™ Threadripper™ PRO 7000 WX-Series Processor, up to 96 Cores
• Chassis: 2U
• Drive: Up to 8x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Slots
• Power Supply: 2x 2600W Redundant (1 + 1) Titanium Level Power Supplies
• Supports NVIDIA RTX PRO™ 6000 Blackwell Max-Q Workstation Edition Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: AI / Deep Learning, VDI, Design & Visualization, 3D Rendering, High Performance Computing, Media/Video Streaming, Cloud Gaming, Diagnostic Imaging
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 5U
• Drive: Up to 24x 2.5" Front Hot-Swap PCIe 5.0 NVMe Drive Bays + 2x M.2 NVMe Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 2700W Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Digital-twins, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics, Edge AI Inferencing
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 3U
• Drive: Up to 14x E1.S Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional) or 6x 2.5" Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots (1 DIMM per channel)
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 3x 3200W/2700W Redundant (2 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL, L40S GPU Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Generative AI, AI Inference, Model Training, 3D Graphics and Video Rendering, Cloud Gaming
• CPU: Single AMD EPYC™ 4005/4004 Series Processor Per Node, up to 16 Cores
• Chassis: 3U / 5 Nodes
• Drive: Up to 2x 2.5" Internal Fixed PCIe 5.0 NVMe + 2x 2.5" Internal Fixed SATA Drive Bays Per Node
• RAM: Up to 192GB of DDR5 ECC/non-ECC UDIMM in 4 DIMM Slots Per Node
• GPU: Up to 2 GPUs Per Node
• Network Ports: Flexible Networking Options with PCIe 5.0 MicroLP Interfaces
• Power Supply: 4x 2000W Redundant (3 + 1) Titanium Level Shared Power Supply

* Complete systems only with all 5 nodes populated.

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC