Solutions

• Key Features/Applications: Enterprise Server, iSCSI SAN, HPC, Data Center, Database Processing & Storage, Corporate Database, Appliance Optimized Storage Building Blocks
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 270W TDP
• Chassis: 2U
• Drive: Up to 12x 3.5" Front Hot-Swap SAS/SATA + 2x 2.5" Hot-Swap SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 1200W Redundant Titanium Level Hot-Plug Power Supplies
• For assistance with RAID configuration, please Contact Us.

• Key Features/Applications: High Performance Computing (HPC), VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging, AI Training
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: Full-Tower/5U Rackmount
• Drive: Up to 8x 3.5" Front Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 4 Double-Width or Single-Width GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 2000W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Enterprise Server, iSCSI SAN, HPC, Data Center, Database Processing & Storage, Corporate Database, Appliance Optimized Storage Building Blocks
• CPU: Single AMD EPYC™ 9005/9004 Series Processor, up to 84 Cores
• Chassis: 2U
• Drive: Up to 24x 3.5" Hot-Swap SAS/SATA + 2x 2.5" Hot-Swap SATA Drive Bays. Supports up to 24x 3.5" Hot-Swap SAS/SATA + 6x 2.5" Hot-Swap NVMe/SATA Drive Bays (Optional)
• RAM: Up to 3TB (AMD EPYC™ 9004 Series Processor)/ 4.5TB (AMD EPYC™ 9005 Series Processor) of DDR5 ECC RDIMM in 12 DIMM Slots
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 1x 1600W Titanium Level Power Supply

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Climate and Weather Modeling
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 160 Cores
• Chassis: 8U
• Drive: Up to 18x 2.5" Front Hot-Swap NVMe/SATA Drive Bays + 2x M.2 NVMe (M-Key) Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 6x 3000W Redundant (3 + 3) Titanium Level Power Supplies
• Supports AMD Instinct™ MI300X Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1000W/1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Virtualization, HPC, CDN, Edge Nodes, Cloud Computing, Data Center Optimized, Storage Headnode
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap PCIe 5.0 NVMe/SAS/SATA Drive Bays + 4x 2.5" PCIe 5.0 SAS/SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: Flexible Networking Options with 2 PCIe 5.0 slots + 1 AIOM Networking Slot
• Power Supply: 2x 1000W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) with Flexible I/O and Storage Configurations
• Based on Modular Scalable DeNsity Optimized HPM Form Factor (M-SDNO)
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC