Solutions

• Key Features/Applications: Virtualization, AI Inference, Machine Learning, Software-Defined Storage, Cloud Computing
• CPU: Single 5th/4th Gen AMD EPYC™ 9005/9004 Series Processor, up to 128 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• Network Ports: Flexible Networking Options
• Power Supply: 1600W Redundant Titanium Level Power Supplies
• AMD EPYC™ Turin 9005 Enabled System

• Key Features/Applications: Virtualization, AI Inferencing & Machine Learning, Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 256 Cores
• Chassis: 2U
• Drive: Up to 12x 3.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1600W Redundant Titanium Level Power Supplies

• Key Features/Applications: 2D/3D Content Creation, VR Content Development, AI Inference / Training, 3D Rendering, Product Design and Engineering Simulation
• CPU: Single AMD Ryzen™ Threadripper™ PRO 7000X/WX Series Processor, up to 96 Cores
• Chassis: Mid-Tower
• Drive: Up to 2x 3.5" Internal Fixed SATA + 6x 2.5" Internal Fixed SATA Drive Bays
• RAM: Up to 512GB of DDR5 ECC RDIMM in 4 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports with Broadcom® BCM57416
• Power Supply: Flexible Power Supply Options. 1x 1000W Gold or 1x 1300W Gold or 1x 2000W Platinum Level Power Supplies
• Supports NVIDIA RTX PRO™ 6000 Blackwell Workstation Edition Graphics Cards
• Supermicro’s AS -531AW-TC SuperWorkstation Won NAB Show 2025 Product of the Year Award

Lot 9 Compliance Notice: This product is exempt from Lot 9 requirements in accordance with relevant regulations. Before purchasing, please ensure the equipment type or your intended use for this product aligns with the Lot 9 exemption criteria.

Please find the details here.

• Key Features/Applications: Virtualization, HPC, CDN, Edge Nodes, Cloud Computing, Data Center Optimized, Storage Headnode
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap PCIe 5.0 NVMe/SAS/SATA Drive Bays + 4x 2.5" PCIe 5.0 SAS/SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: Flexible Networking Options with 2 PCIe 5.0 slots + 1 AIOM Networking Slot
• Power Supply: 2x 1000W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) with Flexible I/O and Storage Configurations
• Based on Modular Scalable DeNsity Optimized HPM Form Factor (M-SDNO)
• Supports DC-SCM module with OpenBMC