High Performance Computing (HPC)

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Digital-twins, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics, Edge AI Inferencing
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 3U
• Drive: Up to 14x E1.S Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional) or 6x 2.5" Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots (1 DIMM per channel)
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 3x 3200W/2700W Redundant (2 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL, L40S GPU Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 72 Cores
• Chassis: 4U
• Drive: Up to 8x E1.S Front Hot-Swap NVMe Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM (6400MT/s) or ECC MRDIMM (8800MT/s) in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GBASE-T RJ45 LAN Ports
• Power Supply: 4x 3200W Redundant (3 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Climate and Weather Modeling
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 160 Cores
• Chassis: 8U
• Drive: Up to 18x 2.5" Front Hot-Swap NVMe/SATA Drive Bays + 2x M.2 NVMe (M-Key) Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 6x 3000W Redundant (3 + 3) Titanium Level Power Supplies
• Supports AMD Instinct™ MI300X Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing (HPC), AI/Deep Learning Training, Machine Learning (ML), Climate and Weather Modeling, Database Processing and High Density Storage, Industrial Automation Retail, Data Center
• CPU: Dual AMD EPYC™ 9575F Processors, 64 Cores
• Chassis: 8U
• Drive: 1x 960GB U.2 NVMe SSD + 4x 3.8TB U.3 NVMe SSD
• RAM: 24x 96GB DDR5-6400 ECC RDIMM Memory
• GPU: 8x AMD Instinct™ MI325X Onboard OAM GPUs
• Network Ports: 8x Single Port 400GbE QSFP112 Ports
• Power Supply: 6x 5250W Redundant (3 + 3) Titanium Level Power Supplies
• Pre-Configured AMD Instinct™ MI325X 8-GPU System

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, Conversational AI, AI/Deep Learning Training, Business Intelligence & Analytics, Industrial Automation
• CPU: Dual 5th Gen Intel® Xeon® Platinum 8570 Processor, 56 Cores
• Chassis: 10U
• Drive: 8x 3.8TB U.3 NVMe SSD + 2x 1.92TB M.2 NVMe SSD
• RAM: 32x 96GB DDR5-5600 ECC RDIMM Memory
• GPU: 8x NVIDIA HGX™ B200 GPUs
• DPU: 1x NVIDIA BlueField®-3 DPU 200Gb/s
• Network Ports: 8x 400GbE NDR/ETH OSFP + 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 5250W Redundant (3 + 3) Titanium Level Power Supplies
• Pre-Configured NVIDIA HGX™ B200 8-GPU System

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 8U
• Drive: Up to 19x 2.5" Front Hot-Swap NVMe/SATA Drive Bays + 2x M.2 NVMe Slots
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 8 Double-Wide GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 6x 3000W Redundant (3 + 3) Titanium Level Power Supplies
• NVIDIA Certified System. Supports NVIDIA HGX™ H200 8-GPU