Virtualization

• Key Features/Applications: Virtualization, Cloud Computing, Enterprise Server, Data Center Optimized, Database Processing and Storage
• CPU: Single 3rd Gen Intel® Xeon® Scalable Processor, up to 40 Cores
• Chassis: 1U
• Drive: Up to 10x 2.5" SATA + 1x M.2 Onboard NVMe/SATA Drive Bays
• RAM: Up to 3TB of DDR4 ECC RDIMM/LRDIMM in 8 DIMM Slots
• Network Ports: 2x 10GbE RJ45 LAN ports

Important Information: This SKU and/or associated compatible components are approaching End of Sale (EOS). To ensure you benefit from a full warranty and ongoing support, we recommend considering its alternative SKU: SYS-111E-WR.

• Key Features/Applications: Scientific Virtualization, High-Performance Computing, Rendering, AI/Deep Learning Training
• CPU: Dual 3rd Gen Intel® Xeon® Scalable Processors, up to 40 Cores
• Chassis: Full-Tower
• Drive: Up to 8x 3.5" Hot-Swap NVMe/SATA/SAS + 2x M.2 NVMe/SATA Drive Bays
• RAM: Up to 4TB of DDR4 ECC RDIMM/LRDIMM in 16 DIMM Slots
• GPU: Up to 6 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports

Important Information: This SKU and/or associated compatible components are approaching End of Sale (EOS). To ensure you benefit from a full warranty and ongoing support, we recommend considering its alternative SKU: SYS-741GE-TNRT or SYS-741P-TRT.

• Key Features/Applications: Network Security Appliance, Universal Customer Premise Equipment (uCPE), Softare Defined WAN (SD-WAN), NFV Edge Computing Server, Virtualization Server, IoT Edge Computing / Gateway
• CPU: Single Intel® Xeon® D-2146NT Processor, up to 8 Cores
• Chassis: Compact Form Factor
• Drive: Up to 1x 2.5" SATA + 1x M.2 Onboard NVMe/SATA Drive Bays
• RAM: Up to 512GB of DDR4 ECC LRDIMM in 4 DIMM Slots
• Network Ports: 4x 1GbE RJ45 + 2x 10GbE RJ45 + 2x 10GbE SFP+ LAN Ports

Important Information: This SKU and/or associated compatible components are approaching End of Life (EOL). To ensure you benefit from a full warranty and ongoing support, we recommend considering its alternative SKU: SYS-E300-12D-8CN6P.

• Key Features/Applications: Virtualization, Cloud Computing, All Flash Storage
• CPU: Single AMD EPYC™ 7003/7002 Series Processor, up to 64 Cores
• Chassis: 1U
• Drive: Up to 10x U.2 Hot-Swap NVMe/SATA Drive Bays
• RAM: Up to 4TB of DDR4 ECC RDIMM/LRDIMM in 16 DIMM Slots
• Power Supply: 750W Redundant Titanium Level Power Supplies
• Network Ports: 2x 10GbE RJ45 LAN Ports

Important Information: This SKU and/or associated compatible components are approaching End of Sale (EOS). To ensure you benefit from a full warranty and ongoing support, we recommend considering its alternative SKU: AS -1115SV-WTNRT.

• Key Features/Applications: Virtualization, Enterprise Server, Application and Data Serving, Compute Intensive Applications
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 300W TDP
• Chassis: Tower/4U
• Drive: Up to 8x 3.5" Hot-Swap NVMe/SAS/SATA Drive Bays or 8x 2.5" Hot-Swap NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 1200W Redundant (1+1) Titanium Level Power Supplies

• Key Features/Applications: Virtualization, Enterprise Server, Application and data serving, Compute Intensive Applications
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 40 Cores
• Chassis: 2U
• Drive: Up to 8x 3.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 1200W Redundant (1 + 1) Titanium Level Power Supplies

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• Key Features/Applications: Virtualization, CDN, Edge Nodes, Data Center Optimized, HPC, Cloud Computing, Storage Headnode
• CPU: Single 5th Gen Intel® Xeon® 4510 Processor, 12 Cores
• Chassis: 1U
• Drive: 2x 960GB M.2 NVMe SSD
• RAM: 2x 64GB DDR5-5600 ECC RDIMM Memory
• Network Ports: 2x 10GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 860W Redundant (1 + 1) Titanium Level Power Supplies
• Need more customization? Explore the configurable SYS-111C-NR system.

• Key Features/Applications: Virtualization, Enterprise Server, Application and data serving, Compute Intensive Applications
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 128 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 4x 3.5" Front Hot-Swap NVMe/SAS/SATA + 4x 3.5" Front Hot-Swap SAS/SATA Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 1200W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging
• CPU: Dual 4th Gen Intel® Xeon® Scalable Processors, up to 60 Cores
• Chassis: 5U
• Drive: Up to 24x 2.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 8TB of DDR5 ECC DRAM in 32 DIMM Slots
• GPU: Up to 10 GPUs
• Power Supply: 4x 2700W (2+2) Redundant Titanium Level Power Supplies

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.