Servers

• Key Features/Applications: Enterprise Applications, General Purpose Computing, Cloud Computing, Web/Hosting Applications, Network Appliance, Database/Storage, Storage Headnode, Entry GPU Server
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 4x 3.5" Front Hot-Swap SATA Drive Bays (Optional support for 3.5"/2.5" PCIe 5.0 NVMe and SAS drives)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 1 GPU
• Network Ports: 2x 1GbE RJ45 LAN Ports
• Power Supply: 2x 860W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Networking Appliance, General Purpose Computing, Web Server, Firewall Application, Data Center Optimized, Entry-Level System for SOHO and SMB, Entry GPU Server
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 8x 3.5" Front Hot-Swap SATA Drive Bays (Optional support for 4x 2.5" PCIe 5.0 NVMe/SAS/SATA + 4x 3.5"/2.5" SAS/SATA Drive Bays)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 1 GPU
• Network Ports: 2x 1GbE RJ45 LAN Ports
• Power Supply: 2x 1000W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Enterprise AI, Chatbot/RAG, Document Processing, Content Creation, Recommendation, Synthetic Data Generation, Agentic AI, HPC, CAD/CAE/CFD, Scientific Research (Modular Dynamics, Weather Forecast, Geological Analysis)
• CPU: Single Intel® Xeon® 6731P Processor, 32 Cores
• Chassis: 2U
• Drive: 1x 960GB M.2 PCIe Gen 4.0 NVMe + 2x 3.84TB E1.S PCIe Gen 5.0 NVMe SSD
• RAM: 8x 64GB DDR5-6400 RDIMM Memory
• GPU: 2x NVIDIA RTX PRO™ 6000 Blackwell Server Edition GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports (Broadcom 57416)
• Power Supply: 2x 2700W Redundant Titanium Level Power Supplies
• Pre-Configured Agent Flow AI Inferencing System (SaaS) View Datasheet

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1000W/1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Virtualization, HPC, CDN, Edge Nodes, Cloud Computing, Data Center Optimized, Storage Headnode
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap PCIe 5.0 NVMe/SAS/SATA Drive Bays + 4x 2.5" PCIe 5.0 SAS/SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: Flexible Networking Options with 2 PCIe 5.0 slots + 1 AIOM Networking Slot
• Power Supply: 2x 1000W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) with Flexible I/O and Storage Configurations
• Based on Modular Scalable DeNsity Optimized HPM Form Factor (M-SDNO)
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Virtualization, Cloud Computing, Data Center Optimized, Database/Storage, Storage Headnode, Web Cache, CDN, Video Streaming, AI Inference, Networking Security Appliance, Entry-Level System for SOHO and SMB, Entry GPU Server
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 10x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: 2x 1GbE RJ45 LAN Ports
• Power Supply: 2x 860W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Virtualization, 5G Core and Edge, Cloud Computing, Software-defined Storage, AI Inference and Machine Learning, Enterprise Server
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 10x 2.5" Front Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Networking Slots (OCP NIC 3.0 Compatible)
• Power Supply: 2x 1200W or 2000W Redundant (1 + 1) Titanium Level AC Power Supplies, or 2x 1300W DC Power Supplies
• Support up to 3x 350W or 2x 600W GPUs

• Key Features/Applications: Cloud-Scale Object Storage
• CPU: Single Intel® Xeon® 6730P Processor, 32 Cores
• Chassis: 4U
• Drive: 60x 24TB 3.5" SATA HDD + 2x 960GB U.2 NVMe SSD
• RAM: 16x 32GB DDR5-5200 RDIMM Memory
• Network Ports: 2x 25GbE SFP28 LAN Ports
• Power Supply: 2x 2000W Redundant (1 + 1) Titanium Level Power Supplies
• Storage Controller: Broadcom® 3916 HW RAID
• Pre-Configured 4U Top-Loading Storage Server. View Datasheet

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Enterprise AI, Chatbot/RAG, Document Processing, Content Creation, Recommendation, Synthetic Data Generation, Agentic AI, LLM/VLM finetuning/training, HPC, CAD/CAE/CFD, Scientific Research (Modular Dynamics, Weather Forecast, Geological Analysis)
• CPU: Dual Intel® Xeon® 6960P Processor, 72 Cores Per CPU
• Chassis: 4U
• Drive: 1x 960GB M.2 PCIe Gen 4.0 NVMe + 2x 3.8TB U.2 PCIe Gen 4.0 NVMe SSD
• RAM: 16x 64GB DDR5-6400 RDIMM Memory
• GPU: 4x NVIDIA RTX PRO™ 6000 Blackwell Server Edition GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports (Intel X710-AT2)
• Power Supply: 4x 3200W Redundant Titanium Level Power Supplies
• Pre-Configured Agent Flow AI Inferencing System (PaaS) View Datasheet

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.