X14 Systems

• Key Features/Applications: 5G Core and Edge, AI Inference and Machine Learning, Network Function Virtualization (NFV), Cloud Computing
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 144 Cores
• Chassis: 2U
• Drive: Up to 2x 2.5" Front Hot-Swap PCIe 5.0 NVMe Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 2x 10GbE RJ45 + 2x 10GbE SFP+ LAN Ports
• Power Supply: 2x 800W Redundant (1 + 1) Titanium Level Power Supplies
• NEBS-Level 3 Compliant

• Key Features/Applications: Multi-Access Edge Computing (MEC), Flex-RAN, Open-RAN vBBU, Artificial Intelligence (AI) on Edge, DU of 5G Application, Satellite Communication
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 144 Cores
• Chassis: 1U
• Drive: Up to 2x 2.5" Internal Fixed NVMe/SATA Drive Bays
• RAM: Up to 1TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 1 GPU
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 800W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1000W/1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Virtualization, HPC, CDN, Edge Nodes, Cloud Computing, Data Center Optimized, Storage Headnode
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap PCIe 5.0 NVMe/SAS/SATA Drive Bays + 4x 2.5" PCIe 5.0 SAS/SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: Flexible Networking Options with 2 PCIe 5.0 slots + 1 AIOM Networking Slot
• Power Supply: 2x 1000W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) with Flexible I/O and Storage Configurations
• Based on Modular Scalable DeNsity Optimized HPM Form Factor (M-SDNO)
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Virtualization, 5G Core and Edge, Cloud Computing, Software-defined Storage, AI Inference and Machine Learning, Enterprise Server
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 10x 2.5" Front Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Networking Slots (OCP NIC 3.0 Compatible)
• Power Supply: 2x 1200W or 2000W Redundant (1 + 1) Titanium Level AC Power Supplies, or 2x 1300W DC Power Supplies
• Support up to 3x 350W or 2x 600W GPUs

• Key Features/Applications: Virtualization, Cloud Computing, Data Center Optimized, Database/Storage, Storage Headnode, Web Cache, CDN, Video Streaming, AI Inference, Networking Security Appliance, Entry-Level System for SOHO and SMB, Entry GPU Server
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 10x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: 2x 1GbE RJ45 LAN Ports
• Power Supply: 2x 860W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: AI / Deep Learning, VDI, Design & Visualization, 3D Rendering, High Performance Computing, Media/Video Streaming, Cloud Gaming, Diagnostic Imaging
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 5U
• Drive: Up to 24x 2.5" Front Hot-Swap PCIe 5.0 NVMe Drive Bays + 2x M.2 NVMe Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 2700W Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Designed for CAD and 3D Modeling Applications, 2D/3D Content Creation, VR Content Development, 1 Thunderbolt™ 4.0 Type-C® Port
• CPU: Single Intel® Core™ Ultra 9/7/5 (Series 2) Processor, up to 24 Cores
• Chassis: Mid-Tower
• Drive: Up to 2x 3.5"/2.5” Internal Fixed SATA + 4x 2.5" Internal Fixed SATA Drive Bays
• RAM: Up to 192GB of DDR5 ECC/non-ECC UDIMM in 4 DIMM Slots
• GPU: Up to 1 GPU
• Network Ports: 1x 1GbE RJ45 + 1x 2.5GbE RJ45 LAN Ports (AMT/vPro)
• Power Supply: 1x 1000W Gold Level Power Supplies
• Supports NVIDIA RTX PRO™ 6000 Blackwell Workstation Edition Graphics Cards
• Supports 1 Thunderbolt™ 4.0 Type-C® Port for high-speed connectivity

Lot 9 Compliance Notice: This product is exempt from Lot 9 requirements in accordance with relevant regulations. Before purchasing, please ensure the equipment type or your intended use for this product aligns with the Lot 9 exemption criteria.

Please find the details here.

• Key Features/Applications: Multi-Access Edge Computing (MEC), Industrial Automation, Machine Learning (ML), Universal Customer Premise Equipment (uCPE), Artificial Intelligence at the Edge, Smart Retail, Medical Expert Systems
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 48 Cores (P-cores)/144 Cores (E-cores)
• Chassis: Fan-based Embedded
• Drive: Up to 2x 2.5" Front Hot-Swap NVMe + 2x 2.5" Internal Fixed SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 2x GPUs Single-Width or 1x GPU Double-Width (up to 350W)
• Network Ports: 2x 10GbE RJ45 LAN Ports

Lot 9 Compliance Notice: This product is exempt from Lot 9 requirements in accordance with relevant regulations. Before purchasing, please ensure the equipment type or your intended use for this product aligns with the Lot 9 exemption criteria.

Please find the details here.