AI and Deep Learning

• Key Features/Applications: Virtualization, AI Inference, Machine Learning, Software-Defined Storage, Cloud Computing
• CPU: Single 5th/4th Gen AMD EPYC™ 9005/9004 Series Processor, up to 128 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• Network Ports: Flexible Networking Options
• Power Supply: 1600W Redundant Titanium Level Power Supplies
• AMD EPYC™ Turin 9005 Enabled System

• Key Features/Applications: High-Performance Computing, AI / Deep Learning
• CPU: Dual AMD EPYC™ 9004 Series Processors, up to 128 Cores
• Chassis: 4U
• Drive: Up to 2x 2.5" Hot-Swap SATA + 4x 2.5" Hot-Swap NVMe Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM/LRDIMM in 24 DIMM Slots
• GPU: Up to 8 Double-Width GPUs
• Power Supply: 4x 2000W Redundant Titanium Level Power Supplies
• Network Ports: 2x 10GbE RJ45 LAN Ports

• Key Features/Applications: Virtualization, AI Inferencing & Machine Learning, Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual 4th Gen AMD EPYC™ 9004 Series Processors, up to 256 Cores
• Chassis: 2U
• Drive: Up to 12x 3.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1600W Redundant Titanium Level Power Supplies

• Key Features/Applications: Virtualization, AI Inferencing & Machine Learning, Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual 4th Gen AMD EPYC™ 9004 Series Processors, up to 256 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• Network Ports: Flexible Networking Options
• Power Supply: 1600W Redundant Platinum Level Power Supplies

• Key Features/Applications: Virtualization, Software-defined Storage, AI Inference and Machine Learning, Cloud Computing, Enterprise Server
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U
• Drive: Up to 8x 2.5" Hot-Swap NVMe/SATA/SAS Drive Bays. Supports up to 16x 2.5" Hot-Swap NVMe/SATA/SAS Drive Bays (Optional)
• RAM: Up to 8TB of DDR5 ECC DRAM in 32 DIMM Slots
• GPU: Up to 4 Double-Width GPUs
• Network Ports: Flexible Networking Options

• Key Features/Applications: Multi-Access Edge Computing, Artificial Intelligence (AI) on Edge, Satellite Communication, Flex-RAN, Open-RAN vBBU, DU of 5G Application
• CPU: Single 5th/4th Gen Intel® Xeon® Scalable Processors, up to 32 Cores
• Chassis: 1U
• Drive: Up to 2x 2.5" SATA + 1x M.2 NVMe Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 800W Redundant (1+1) Titanium Level Power Supplies

• Key Features/Applications: Virtualization, AI Inference and Machine Learning, Software-defined Storage, Cloud Computing, Data Center Optimized, AI Inference, Database Processing and High Density Storage
• CPU: Single Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe*/SAS/SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 1 Double-Width or 2 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies

* Intel Xeon 6700E-series only support 8 NVMe.

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing (HPC), VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging, AI Training
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: Full-Tower/5U Rackmount
• Drive: Up to 8x 3.5" Front Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 4 Double-Width or Single-Width GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 2000W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Digital-twins, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics, Edge AI Inferencing
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 3U
• Drive: Up to 14x E1.S Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional) or 6x 2.5" Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots (1 DIMM per channel)
• GPU: Up to 4x 600W or 8x 350W GPUs (Direct-attached Architecture)
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 3x 3200W/2700W Redundant (2 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL, RTX PRO™ 6000 Blackwell Server Edition/Max-Q Workstation Edition, L40S GPU Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: AI / Deep Learning, VDI, Design & Visualization, 3D Rendering, High Performance Computing, Media/Video Streaming, Cloud Gaming, Diagnostic Imaging
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 5U
• Drive: Up to 24x 2.5" Front Hot-Swap PCIe 5.0 NVMe Drive Bays + 2x M.2 NVMe Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 2700W Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL 141GB PCIe 5.0 Graphics Card

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.