Servers

• Key Features/Applications: Multi-Access Edge Computing (MEC), Industrial Automation, Machine Learning (ML), Universal Customer Premise Equipment (uCPE), Artificial Intelligence at the Edge, Smart Retail, Medical Expert Systems
• CPU: Single 5th/4th Gen Intel® Xeon® Scalable Processors, up to 32 Cores
• Chassis: Fan-based Embedded
• Drive: Up to 2x 2.5" Front Hot-Swap NVMe + 2x 2.5" Internal Fixed SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 3DS ECC RDIMM in 8 DIMM Slots
• GPU: Up to 2x GPUs Single-Width or 1x GPU Double-Width (up to 350W)
• Network Ports: 2x 10GbE RJ45 LAN Ports

Lot 9 Compliance Notice: This product is exempt from Lot 9 requirements in accordance with relevant regulations. Before purchasing, please ensure the equipment type or your intended use for this product aligns with the Lot 9 exemption criteria.

Please find the details here.

• Key Features/Applications: Multi-Access Edge Computing (MEC), Industrial Automation, Machine Learning (ML), Universal Customer Premise Equipment (uCPE), Artificial Intelligence at the Edge, Smart Retail, Medical Expert Systems
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 48 Cores (P-cores)/144 Cores (E-cores)
• Chassis: Fan-based Embedded
• Drive: Up to 2x 2.5" Front Hot-Swap NVMe + 2x 2.5" Internal Fixed SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 2x GPUs Single-Width or 1x GPU Double-Width (up to 350W)
• Network Ports: 2x 10GbE RJ45 LAN Ports

Lot 9 Compliance Notice: This product is exempt from Lot 9 requirements in accordance with relevant regulations. Before purchasing, please ensure the equipment type or your intended use for this product aligns with the Lot 9 exemption criteria.

Please find the details here.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 8U
• Drive: Up to 19x 2.5" Front Hot-Swap NVMe/SATA Drive Bays + 2x M.2 NVMe Slots
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 8 Double-Wide GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 6x 3000W Redundant (3 + 3) Titanium Level Power Supplies
• NVIDIA Certified System. Supports NVIDIA HGX™ H200 8-GPU
• Success Story: Building Massive AI Cloud Scalable Infrastructure for Advanced AI Training

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Climate and Weather Modeling
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 160 Cores
• Chassis: 8U
• Drive: Up to 18x 2.5" Front Hot-Swap NVMe/SATA Drive Bays + 2x M.2 NVMe (M-Key) Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 6x 3000W Redundant (3 + 3) Titanium Level Power Supplies
• Supports AMD Instinct™ MI300X Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Multi-Access Edge Computing (MEC), Flex-RAN, Open-RAN vBBU, Artificial Intelligence (AI) on Edge, DU of 5G Application, Satellite Communication
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 144 Cores
• Chassis: 1U
• Drive: Up to 2x 2.5" Internal Fixed NVMe/SATA Drive Bays
• RAM: Up to 1TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 1 GPU
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 800W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1000W/1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Virtualization, HPC, CDN, Edge Nodes, Cloud Computing, Data Center Optimized, Storage Headnode
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap PCIe 5.0 NVMe/SAS/SATA Drive Bays + 4x 2.5" PCIe 5.0 SAS/SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: Flexible Networking Options with 2 PCIe 5.0 slots + 1 AIOM Networking Slot
• Power Supply: 2x 1000W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) with Flexible I/O and Storage Configurations
• Based on Modular Scalable DeNsity Optimized HPM Form Factor (M-SDNO)
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Self-Checkout Kiosk - Retail, Short Depth, Intelligent Edge
• CPU: Single Intel® Core™ i7-12700E Processor, 12 Cores
• Chassis: 1U
• Drive: 2x 1.92TB 2.5" SATA SSD
• RAM: 2x 32GB DDR5-5600 UDIMM Memory
• Network Ports: 2x 2.5GbE RJ45 LAN Ports
• Power Supply: 1x 200W Gold Level Power Supply
• Need more customization? Explore the configurable SYS-111AD-HN2 system.

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: 5G Core and Edge, AI Inference and Machine Learning, Network Function Virtualization (NFV), Cloud Computing
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 144 Cores
• Chassis: 2U
• Drive: Up to 2x 2.5" Front Hot-Swap PCIe 5.0 NVMe Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 2x 10GbE RJ45 + 2x 10GbE SFP+ LAN Ports
• Power Supply: 2x 800W Redundant (1 + 1) Titanium Level Power Supplies
• NEBS-Level 3 Compliant