Solutions

• Key Features/Applications: Virtualization, Cloud Computing, High End Enterprise Server
• CPU: Dual AMD EPYC™ 7003/7002 Series Processors, up to 64 Cores
• Chassis: 1U
• Drive: Up to 4x 3.5" Hot-Swap SATA Drive Bays
• RAM: Up to 8TB of DDR4 ECC RDIMM in 32 DIMM Slots
• Power Supply: 1000W Redundant Titanium Level Power Supplies
• Network Ports: 2x 10GbE RJ45 LAN Ports

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• Key Features/Applications: AI / Deep Learning, High Performance Computing (HPC), Cloud Gaming, Molecular Dynamics Simulation
• CPU: Dual AMD EPYC™ 7003/7002 Series Processors, up to 128 Cores
• Chassis: 4U
• Drive: Up to 24x 2.5" SAS/SATA Drive Bays
• RAM: Up to 8TB of DDR4 ECC RDIMM/LRDIMM in 32 DIMM Slots
• GPU: Up to 8 GPUs
• Power Supply: 2000W (2+2) Redundant Titanium Level Power Supplies
• Network Ports: 2x 1GbE RJ45 LAN Ports

• Key Features/Applications: Web/Hosting Application, Email/Firewall/Application Server, Designed for small and medium businesses
• CPU: Single AMD EPYC™ 4004 or AMD Ryzen™ 7000 Series Processors, up to 16 Cores
• Chassis: 1U
• Drive: Up to 1x 3.5" SATA Drive Bays or 4x 2.5" SATA Drive Bays (Optional)
• RAM: Up to 192GB of DDR5 ECC UDIMM in 4 DIMM Slots
• GPU: Up to 1 GPU
• Network Ports: 2x 1GbE RJ45 LAN Ports
• Power Supply: 500W High-Efficiency Platinum Level Power Supplies

• Key Features/Applications: Virtualization, Cloud Computing, High-End Enterprise Server, Hyperconverged Storage
• CPU: Dual AMD EPYC™ 7003/7002 Series Processors, up to 64 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Hot-Swap U.2 NVMe Drive Bays or 24x 2.5" Hot-Swap SAS/SATA Drive Bays (Optional)
• RAM: Up to 8TB of DDR4 ECC SDRAM in 32 DIMM Slots
• Network Ports: Flexible Networking Options
• Power Supply: 1600W Redundant Titanium Level Power Supplies

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• Key Features/Applications: Virtualization, Data Center Optimized, Firewall Applications, Database/Storage, Edge/Cloud Computing Services
• CPU: Single AMD EPYC™ 8004 Series Processor, up to 64 Cores
• Chassis: 1U
• Drive: Up to 10x 2.5" Front Hot-Swap SATA Drive Bays or 10x 2.5" Hot-Swap NVMe/SAS Drive Bays (Optional)
• RAM: Up to 576GB of DDR5 ECC RDIMM in 6 DIMM Slots
• GPU: Up to 1 Double-Width or 2 Single-Width GPUs
• Network Ports: 2x 10GBase-T RJ45 LAN Ports
• Power Supply: 2x 860W Redundant Titanium Level Power Supplies

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• Key Features/Applications: Industrial Automation, Retail, Digital Signage, Kiosk, Interactive info system, Smart Medical Expert Systems, IoT Gateway for Smart Factory, Smart Building, Security and Surveillance
• CPU: Single Intel® Celeron® 7305E Processor, up to 5 Cores
• Chassis: Fanless Embedded
• Drive: Up to 1x M.2 SATA B-Key 2242/2280 + 1x M.2 NVMe M-Key 2242/2280 + 1x M.2 Slot (E-Key 2230; USB 2.0)
• RAM: Up to 64GB of DDR5 Non-ECC SO-DIMM in 2 DIMM Slots
• Network Ports: 2x 2.5GbE RJ45 LAN Ports
• Wi-Fi enabled system. Support for Wi-Fi 4, 5, 6, 6E R2, and Bluetooth® 5.3

• Key Features/Applications: High Performance Computing, VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 4U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 4x 2700W Redundant (2 + 2) Titanium Level Power Supplies

• Key Features/Applications: Hyperconverged Infrastructure, Container Storage, Scale-Out File Server
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U / 4 Node
• Drive: Up to 3x 3.5" Hot-Swap NVMe/SATA Drive Bays Per Node (2x PCIe 5.0 NVMe/SATA and 1x PCIe 4.0 NVMe/SATA) + 2x M.2 NVMe
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots Per Node
• Cooling: Up to 4 Cooling 14.9K RPM Fans Per 2U Enclosure, Shared Cooling Design Liquid Cooling Support
• Network Ports: Network Connectivity via AIOM (OCP 3.0 Compliant)
• Power Supply: 2x 3000W (1 + 1) Redundant Titanium Level Power Supplies, Shared Power Design

• Key Features/Applications: High-Performance File System, Diskless HPC Clusters, Scale Out All-Flash NVMe Storage, Big Data Analytics and AI
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U / 2 Node
• Drive: Up to 12x 2.5" Hot-Swap NVMe/SATA Drive Bays Per Node (2x PCIe 5.0 NVMe/SATA and 10x PCIe 4.0 NVMe/SATA) + 2x M.2 NVMe
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots Per Node
• Cooling: Up to 4 Cooling 16.5K RPM Fans Per 2U Enclosure, Shared Cooling Design Liquid Cooling Support
• Network Ports: Network Connectivity via AIOM (OCP 3.0 Compliant)
• Power Supply: 2x 2200W (1 + 1) Redundant Titanium Level Power Supplies, Shared Power Design

• Key Features/Applications: All-Flash NVMe Hyperconverged Infrastructure, Container-as-a-Service; Application Accelerator, High-Performance File System, Diskless HPC Clusters
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U / 4 Node
• Drive: Up to 6x 2.5" Hot-Swap NVMe/SATA Drive Bays Per Node (2x PCIe 5.0 NVMe/SATA and 4x PCIe 4.0 NVMe/SATA) + 2x M.2 NVMe
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots Per Node
• Cooling: Up to 4 Cooling 16K RPM Fans Per 2U Enclosure, Shared Cooling Design, Counter-Rotating Liquid Cooling Support
• Network Ports: Network Connectivity via AIOM (OCP 3.0 Compliant)
• Power Supply: 2x 3000W (1 + 1) Redundant Titanium Level Power Supplies, Shared Power Design