Solutions

• Key Features/Applications: Virtualization, Cloud Computing, High-End Enterprise Server, Hyperconverged Storage
• CPU: Dual AMD EPYC™ 7003/7002 Series Processors, up to 64 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Hot-Swap U.2 NVMe Drive Bays or 24x 2.5" Hot-Swap SAS/SATA Drive Bays (Optional)
• RAM: Up to 8TB of DDR4 ECC SDRAM in 32 DIMM Slots
• Network Ports: Flexible Networking Options
• Power Supply: 1600W Redundant Titanium Level Power Supplies

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• Key Features/Applications: All-Flash NVMe Hyperconverged Infrastructure, Container-as-a-Service; Application Accelerator, High-Performance File System, Diskless HPC Clusters
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U / 4 Node
• Drive: Up to 6x 2.5" Hot-Swap NVMe/SATA Drive Bays Per Node (2x PCIe 5.0 NVMe/SATA and 4x PCIe 4.0 NVMe/SATA) + 2x M.2 NVMe
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots Per Node
• Cooling: Up to 4 Cooling 16K RPM Fans Per 2U Enclosure, Shared Cooling Design, Counter-Rotating Liquid Cooling Support
• Network Ports: Network Connectivity via AIOM (OCP 3.0 Compliant)
• Power Supply: 2x 3000W (1 + 1) Redundant Titanium Level Power Supplies, Shared Power Design

• Key Features/Applications: Hyperconverged Infrastructure, Container Storage, Scale-Out File Server
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U / 4 Node
• Drive: Up to 3x 3.5" Hot-Swap NVMe/SATA Drive Bays Per Node (2x PCIe 5.0 NVMe/SATA and 1x PCIe 4.0 NVMe/SATA) + 2x M.2 NVMe
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots Per Node
• Cooling: Up to 4 Cooling 14.9K RPM Fans Per 2U Enclosure, Shared Cooling Design Liquid Cooling Support
• Network Ports: Network Connectivity via AIOM (OCP 3.0 Compliant)
• Power Supply: 2x 3000W (1 + 1) Redundant Titanium Level Power Supplies, Shared Power Design