X14 Systems

• Key Features/Applications: AI / Deep Learning, Conversational AI, High Performance Computing (HPC), Scientific Research, Drug Discovery
• CPU: Dual Intel® Xeon® 6960P Processors, 72 Cores
• Chassis: 10U
• Drive: 2x 1.9TB M.2 NVMe SSD + 4x 1.9TB U.2 NVMe SSD
• RAM: 24x 96GB DDR5-6400 ECC RDIMM Memory
• GPU: 8x NVIDIA HGX™ B200 GPUs
• DPU: 1x NVIDIA BlueField®-3 DPU 200Gb/s
• Network Ports: 8x 400GbE NDR/ETH OSFP + 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 5250W Redundant (3 + 3) Titanium Level Power Supplies
• Pre-Configured NVIDIA HGX™ B200 8-GPU System

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, AI Inference and Machine Learning, Software-defined Storage, Cloud Computing, Data Center Optimized, AI Inference, Database Processing and High Density Storage
• CPU: Single Intel® Xeon® 6 6521P Processor, 24 Cores
• Chassis: 2U
• Drive: 1x 960GB M.2 NVMe SSD
• RAM: 1x 32GB DDR5-6400 ECC RDIMM Memory
• Network Ports: 2x 10GbE RJ45 LAN Ports via AIOM
• Need more customization? Explore the configurable SYS-212H-TN system.

• Key Features/Applications: Virtualization, Enterprise Server, Application and data serving, Compute Intensive Applications
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 128 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 4x 3.5" Front Hot-Swap NVMe/SAS/SATA + 4x 3.5" Front Hot-Swap SAS/SATA Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 1200W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Multi-Access Edge Computing (MEC), Industrial Automation, Machine Learning (ML), Universal Customer Premise Equipment (uCPE), Artificial Intelligence at the Edge, Smart Retail, Medical Expert Systems
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 48 Cores (P-cores)/144 Cores (E-cores)
• Chassis: Fan-based Embedded
• Drive: Up to 2x 2.5" Front Hot-Swap NVMe + 2x 2.5" Internal Fixed SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 2x GPUs Single-Width or 1x GPU Double-Width (up to 350W)
• Network Ports: 2x 10GbE RJ45 LAN Ports

Lot 9 Compliance Notice: This product is exempt from Lot 9 requirements in accordance with relevant regulations. Before purchasing, please ensure the equipment type or your intended use for this product aligns with the Lot 9 exemption criteria.

Please find the details here.

• Key Features/Applications: Designed for CAD and 3D Modeling Applications, 2D/3D Content Creation, VR Content Development, 1 Thunderbolt™ 4.0 Type-C® Port
• CPU: Single Intel® Core™ Ultra 9/7/5 (Series 2) Processor, up to 24 Cores
• Chassis: Mid-Tower
• Drive: Up to 2x 3.5"/2.5” Internal Fixed SATA + 4x 2.5" Internal Fixed SATA Drive Bays
• RAM: Up to 192GB of DDR5 ECC/non-ECC UDIMM in 4 DIMM Slots
• GPU: Up to 1 GPU
• Network Ports: 1x 1GbE RJ45 + 1x 2.5GbE RJ45 LAN Ports (AMT/vPro)
• Power Supply: 1x 1000W Gold Level Power Supplies
• Supports NVIDIA RTX PRO™ 6000 Blackwell Workstation Edition Graphics Cards
• Supports 1 Thunderbolt™ 4.0 Type-C® Port for high-speed connectivity

Lot 9 Compliance Notice: This product is exempt from Lot 9 requirements in accordance with relevant regulations. Before purchasing, please ensure the equipment type or your intended use for this product aligns with the Lot 9 exemption criteria.

Please find the details here.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Digital-twins, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics, Edge AI Inferencing
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 3U
• Drive: Up to 14x E1.S Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional) or 6x 2.5" Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots (1 DIMM per channel)
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 3x 3200W/2700W Redundant (2 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL, L40S GPU Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: AI / Deep Learning, VDI, Design & Visualization, 3D Rendering, High Performance Computing, Media/Video Streaming, Cloud Gaming, Diagnostic Imaging
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 5U
• Drive: Up to 24x 2.5" Front Hot-Swap PCIe 5.0 NVMe Drive Bays + 2x M.2 NVMe Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 2700W Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, High Performance Computing, Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays. Supports up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 1 Double-Width or 3 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, AI Inference and Machine Learning, Software-defined Storage, Cloud Computing, Data Center Optimized, AI Inference, Database Processing and High Density Storage
• CPU: Single Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe*/SAS/SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 1 Double-Width or 2 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• Need it ASAP? Shop our Ready-to-Deploy Gold Series Configuration: SYS-212H-TN-G1.

* Intel Xeon 6700E-series only support 8 NVMe.

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, Financial, Scale Out All-Flash NVMe Storage, Cloud Computing, Data Center Enterprise Applications, AI Inference, CDN/vCDN/Cloud CDN
• CPU: Single Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe*/SAS/SATA Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 1 Double-Width or 2 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies

* Intel Xeon 6700E-series only support 8 NVMe.

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.