AI and Deep Learning

• Key Features/Applications: Multi-Access Edge Computing (MEC), Industrial Automation, Machine Learning (ML), Universal Customer Premise Equipment (uCPE), Artificial Intelligence at the Edge, Smart Retail, Medical Expert Systems
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 48 Cores (P-cores)/144 Cores (E-cores)
• Chassis: Fan-based Embedded
• Drive: Up to 2x 2.5" Front Hot-Swap NVMe + 2x 2.5" Internal Fixed SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 2x GPUs Single-Width or 1x GPU Double-Width (up to 350W)
• Network Ports: 2x 10GbE RJ45 LAN Ports

Lot 9 Compliance Notice: This product is exempt from Lot 9 requirements in accordance with relevant regulations. Before purchasing, please ensure the equipment type or your intended use for this product aligns with the Lot 9 exemption criteria.

Please find the details here.

• Key Features/Applications: Multi-Access Edge Computing (MEC), Industrial Automation, Machine Learning (ML), Universal Customer Premise Equipment (uCPE), Artificial Intelligence at the Edge, Smart Retail, Medical Expert Systems
• CPU: Single 5th/4th Gen Intel® Xeon® Scalable Processors, up to 32 Cores
• Chassis: Fan-based Embedded
• Drive: Up to 2x 2.5" Front Hot-Swap NVMe + 2x 2.5" Internal Fixed SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 3DS ECC RDIMM in 8 DIMM Slots
• GPU: Up to 2x GPUs Single-Width or 1x GPU Double-Width (up to 350W)
• Network Ports: 2x 10GbE RJ45 LAN Ports

Lot 9 Compliance Notice: This product is exempt from Lot 9 requirements in accordance with relevant regulations. Before purchasing, please ensure the equipment type or your intended use for this product aligns with the Lot 9 exemption criteria.

Please find the details here.

• Key Features/Applications: Virtualization, Software-defined Storage, AI Inference and Machine Learning, Cloud Computing, Enterprise Server
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Networking Slots (OCP NIC 3.0 compatible)
• Power Supply: 2x 1600W Redundant Titanium Level Power Supplies

• Key Features/Applications: 2D/3D Content Creation, VR Content Development, AI Inference / Training, 3D Rendering, Product Design and Engineering Simulation
• CPU: Single AMD Ryzen™ Threadripper™ PRO 7000X/WX Series Processor, up to 96 Cores
• Chassis: Mid-Tower
• Drive: Up to 2x 3.5" Internal Fixed SATA + 6x 2.5" Internal Fixed SATA Drive Bays
• RAM: Up to 512GB of DDR5 ECC RDIMM in 4 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports with Broadcom® BCM57416
• Power Supply: Flexible Power Supply Options. 1x 1000W Gold or 1x 1300W Gold or 1x 2000W Platinum Level Power Supplies
• Supports NVIDIA RTX PRO™ 6000 Blackwell Workstation Edition or Max-Q Workstation Edition Graphics Cards
• Supermicro’s AS -531AW-TC SuperWorkstation Won NAB Show 2025 Product of the Year Award

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Digital-twins, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics, Edge AI Inferencing
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 3U
• Drive: Up to 14x E1.S Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional) or 6x 2.5" Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots (1 DIMM per channel)
• GPU: Up to 4x 600W or 8x 350W GPUs (Direct-attached Architecture)
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 3x 3200W/2700W Redundant (2 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL, RTX PRO™ 6000 Blackwell Server Edition/Max-Q Workstation Edition, L40S GPU Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging
• CPU: Dual 4th Gen Intel® Xeon® Scalable Processors, up to 60 Cores
• Chassis: 5U
• Drive: Up to 24x 2.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 8TB of DDR5 ECC DRAM in 32 DIMM Slots
• GPU: Up to 10 GPUs
• Power Supply: 4x 2700W (2+2) Redundant Titanium Level Power Supplies

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: AI / Deep Learning, VDI, Design & Visualization, 3D Rendering, High Performance Computing, Media/Video Streaming, Cloud Gaming, Diagnostic Imaging
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 5U
• Drive: Up to 24x 2.5" Front Hot-Swap PCIe 5.0 NVMe Drive Bays + 2x M.2 NVMe Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 2700W Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL 141GB PCIe 5.0 Graphics Card

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: AI / Deep Learning, Visualization / Simulation, 3D Rendering Farm, High Performance Computing, Multimedia/Digital Content creation
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 192 Cores/500W TDP
• Chassis: 5U
• Drive: Up to 8x 2.5" Front Hot-Swap NVMe + 2x 2.5" Front Hot-Swap SATA Drive Bays + 1x M.2 NVMe Slots
• RAM: Up to 9TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 2700W (3 + 3) Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL 141GB PCIe 5.0 Graphics Card

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: AI / Deep Learning, Visualization / Simulation, 3D Rendering Farm, High Performance Computing, Multimedia/Digital Content creation
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 192 Cores/500W TDP
• Chassis: 5U
• Drive: Up to 4x 2.5" Front Hot-Swap NVMe + 2x 2.5" Front Hot-Swap SATA Drive Bays + 1x M.2 NVMe Slots
• RAM: Up to 9TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 2700W (3 + 3) Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL 141GB PCIe 5.0 Graphics Card

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High-Performance File System, Diskless HPC Clusters, Scale Out All-Flash NVMe Storage, Big Data Analytics and AI
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U / 2 Nodes
• Drive: Up to 12x 2.5" Hot-Swap NVMe/SATA Drive Bays Per Node (2x PCIe 5.0 NVMe/SATA and 10x PCIe 4.0 NVMe/SATA) + 2x M.2 NVMe
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots Per Node
• Cooling: Up to 4 Cooling 16.5K RPM Fans Per 2U Enclosure, Shared Cooling Design Liquid Cooling Support
• Network Ports: Network Connectivity via AIOM (OCP 3.0 Compliant)
• Power Supply: 2x 2200W (1 + 1) Redundant Titanium Level Power Supplies, Shared Power Design

* Complete systems only with all 2 nodes populated.