Networking

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1000W/1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Virtualization, Data Center Optimized, Edge/Cloud Computing Services, Database/Storage, Firewall Applications
• CPU: Single AMD EPYC™ 8004 Series Processor, up to 64 Cores
• Chassis: 1U
• Drive: Up to 4x 3.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 768GB of DDR5 ECC RDIMM in 6 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: 2x 10GBase-T RJ45 LAN Ports
• Power Supply: 2x 860W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Software-defined Storage, In-Memory Computing, Data Intensive HPC, Private & Hybrid Cloud, NVMe Over Fabrics Solution
• CPU: Dual 4th Gen Intel® Xeon® Scalable Processors, up to 32 Cores
• Chassis: 1U
• Drive: Up to 24x E1.S Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM/LRDIMM in 32 DIMM Slots
• Network Ports: 1x RJ45 LAN Ports + Flexible AIOM Option
• Power Supply: 2000W Redundant Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.