Solutions

• Key Features/Applications: Virtualization, Financial, Scale Out All-Flash NVMe Storage, Cloud Computing, Data Center Enterprise Applications, AI Inference, CDN/vCDN/Cloud CDN
• CPU: Single Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe*/SAS/SATA Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 1 Double-Width or 2 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies

* Intel Xeon 6700E-series only support 8 NVMe.

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, AI Inference and Machine Learning, Software-defined Storage, Cloud Computing, Data Center Optimized, AI Inference, Database Processing and High Density Storage
• CPU: Single Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe*/SAS/SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 1 Double-Width or 2 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies

* Intel Xeon 6700E-series only support 8 NVMe.

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, High Performance Computing, Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays. Supports up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 1 Double-Width or 3 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, HPC, CDN, Edge Nodes, Cloud Computing, Data Center Optimized, Storage Headnode
• CPU: Single AMD EPYC™ 9005/9004 Series Processor, up to 192 Cores
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap PCIe 5.0 NVMe/SAS/SATA Drive Bays + 4x 2.5" PCIe 5.0 NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Supports DDR5 ECC RDIMM in 12 DIMM Slots
• Network Ports: Flexible Networking Options with 1 AIOM Networking Slot
• Power Supply: 2x 1000W/1200W/1600W/2000W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers, Based on the OCP Data Center Modular Hardware System (DC-MHS) with Flexible I/O and Storage Configurations

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, Software-defined Storage, AI Inference and Machine Learning, Cloud Computing, Enterprise Server
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Networking Slots (OCP NIC 3.0 compatible)
• Power Supply: 2x 1600W Redundant Titanium Level Power Supplies

• Key Features/Applications: Virtualization, AI Inferencing & Machine Learning, Enterprise Server, Software-Defined Storage, Cloud Computing, High Performance Computing (HPC)
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SATA Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• Network Ports: Flexible Networking Options with 1 AIOM Networking Slot (OCP NIC 3.0 compatible)
• Power Supply: 2x 1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 8U
• Drive: Up to 19x 2.5" Front Hot-Swap NVMe/SATA Drive Bays + 2x M.2 NVMe Slots
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 8 Double-Wide GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 6x 3000W Redundant (3 + 3) Titanium Level Power Supplies
• NVIDIA Certified System. Supports NVIDIA HGX™ H200 8-GPU
• Success Story: Building Massive AI Cloud Scalable Infrastructure for Advanced AI Training

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Generative AI, AI Inference, Model Training, 3D Graphics and Video Rendering, Cloud Gaming
• CPU: Single AMD EPYC™ 4005/4004 Series Processor Per Node, up to 16 Cores
• Chassis: 3U / 5 Nodes
• Drive: Up to 2x 2.5" Internal Fixed PCIe 5.0 NVMe + 2x 2.5" Internal Fixed SATA Drive Bays Per Node
• RAM: Up to 192GB of DDR5 ECC/non-ECC UDIMM in 4 DIMM Slots Per Node
• GPU: Up to 2 GPUs Per Node
• Network Ports: Flexible Networking Options with PCIe 5.0 MicroLP Interfaces
• Power Supply: 4x 2000W Redundant (3 + 1) Titanium Level Shared Power Supply

* Complete systems only with all 5 nodes populated.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Climate and Weather Modeling
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 160 Cores
• Chassis: 8U
• Drive: Up to 18x 2.5" Front Hot-Swap NVMe/SATA Drive Bays + 2x M.2 NVMe (M-Key) Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 6x 3000W Redundant (3 + 3) Titanium Level Power Supplies
• Supports AMD Instinct™ MI300X Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Big Data & Analytics, Data Lake, Telco & Cloud Service Providers, Content Repositories, HPC and AI/ML Workloads, Financial Services & Healthcare Image Archives, Government Data Protection
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 144 Cores
• Chassis: 4U
• Drive: Up to 90x 3.5"/2.5" Top-Loading Hot-Swap SAS/SATA + 4x 2.5" Rear Hot-Swap NVMe + 2x 2.5" Fixed Internal NVMe Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: Flexible Networking Options
• Power Supply: 2x 2600W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.