High Performance Computing (HPC)

• Key Features/Applications: Enterprise AI, Chatbot/RAG, Document Processing, Content Creation, Recommendation, Synthetic Data Generation, Agentic AI, HPC, CAD/CAE/CFD, Scientific Research (Modular Dynamics, Weather Forecast, Geological Analysis)
• CPU: Single Intel® Xeon® 6731P Processor, 32 Cores
• Chassis: 2U
• Drive: 1x 960GB M.2 PCIe Gen 4.0 NVMe + 2x 3.84TB E1.S PCIe Gen 5.0 NVMe SSD
• RAM: 8x 64GB DDR5-6400 RDIMM Memory
• GPU: 2x NVIDIA RTX PRO™ 6000 Blackwell Server Edition GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports (Broadcom 57416)
• Power Supply: 2x 2700W Redundant Titanium Level Power Supplies
• Pre-Configured Agent Flow AI Inferencing System (SaaS) View Datasheet

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 72 Cores
• Chassis: 4U
• Drive: Up to 8x E1.S Front Hot-Swap NVMe Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM (6400MT/s) or ECC MRDIMM (8800MT/s) in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GBASE-T RJ45 LAN Ports
• Power Supply: 4x 3200W Redundant (3 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Climate and Weather Modeling
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 160 Cores
• Chassis: 8U
• Drive: Up to 18x 2.5" Front Hot-Swap NVMe/SATA Drive Bays + 2x M.2 NVMe (M-Key) Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 6x 3000W Redundant (3 + 3) Titanium Level Power Supplies
• Supports AMD Instinct™ MI300X Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Big Data & Analytics, Data Lake, Telco & Cloud Service Providers, Content Repositories, HPC and AI/ML Workloads, Financial Services & Healthcare Image Archives, Government Data Protection
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 144 Cores
• Chassis: 4U
• Drive: Up to 90x 3.5"/2.5" Top-Loading Hot-Swap SAS/SATA + 4x 2.5" Rear Hot-Swap NVMe + 2x 2.5" Fixed Internal NVMe Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: Flexible Networking Options
• Power Supply: 2x 2600W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Enterprise Server, iSCSI SAN, HPC, Data Center, Database Processing & Storage, Corporate Database, Appliance Optimized Storage Building Blocks
• CPU: Single AMD EPYC™ 9005/9004 Series Processor, up to 84 Cores
• Chassis: 2U
• Drive: Up to 24x 3.5" Hot-Swap SAS/SATA + 2x 2.5" Hot-Swap SATA Drive Bays. Supports up to 24x 3.5" Hot-Swap SAS/SATA + 6x 2.5" Hot-Swap NVMe/SATA Drive Bays (Optional)
• RAM: Up to 3TB (AMD EPYC™ 9004 Series Processor)/ 4.5TB (AMD EPYC™ 9005 Series Processor) of DDR5 ECC RDIMM in 12 DIMM Slots
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 1x 1600W Titanium Level Power Supply

• Key Features/Applications: Enterprise Server, iSCSI SAN, HPC, Data Center, Database Processing & Storage, Corporate Database, Appliance Optimized Storage Building Blocks
• CPU: Single 5th/4th Gen Intel® Xeon® Scalable Processor, up to 36 Cores
• Chassis: 2U
• Drive: Up to 24x 3.5" Hot-Swap SAS/SATA + 2x 2.5" Hot-Swap SATA Drive Bays. Supports up to 24x 3.5" Hot-Swap SAS/SATA + 6x 2.5" Hot-Swap NVMe/SATA Drive Bays (Optional)
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 2x 1600W Redundant Titanium Level Power Supply

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 8U
• Drive: Up to 19x 2.5" Front Hot-Swap NVMe/SATA Drive Bays + 2x M.2 NVMe Slots
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 8 Double-Wide GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 6x 3000W Redundant (3 + 3) Titanium Level Power Supplies
• NVIDIA Certified System. Supports NVIDIA HGX™ H200 8-GPU
• Success Story: Building Massive AI Cloud Scalable Infrastructure for Advanced AI Training

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, AI Inferencing & Machine Learning, Enterprise Server, Software-Defined Storage, Cloud Computing, High Performance Computing (HPC)
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SATA Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• Network Ports: Flexible Networking Options with 1 AIOM Networking Slot (OCP NIC 3.0 compatible)
• Power Supply: 2x 1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Virtualization, HPC, CDN, Edge Nodes, Cloud Computing, Data Center Optimized, Storage Headnode
• CPU: Single AMD EPYC™ 9005/9004 Series Processor, up to 192 Cores
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap PCIe 5.0 NVMe/SAS/SATA Drive Bays + 4x 2.5" PCIe 5.0 NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Supports DDR5 ECC RDIMM in 12 DIMM Slots
• Network Ports: Flexible Networking Options with 1 AIOM Networking Slot
• Power Supply: 2x 1000W/1200W/1600W/2000W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers, Based on the OCP Data Center Modular Hardware System (DC-MHS) with Flexible I/O and Storage Configurations

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Digital-twins, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics, Edge AI Inferencing
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 3U
• Drive: Up to 14x E1.S Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional) or 6x 2.5" Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots (1 DIMM per channel)
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 3x 3200W/2700W Redundant (2 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL, L40S GPU Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.