Servers

• Key Features/Applications: AI/ Deep Learning, High Performance Computing, Big Data Analytics and AI, Engineering/scientific research
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 160 Cores
• Chassis: 4U
• Drive: Up to 10x 2.5" Front Hot-Swap NVMe/SATA Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 4x 2000W Redundant (2+2 or 3+1) Titanium Level Power Supplies

• Key Features/Applications: Software-defined Storage, In-Memory Computing, Data Intensive HPC, Private & Hybrid Cloud, NVMe Over Fabrics Solution
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processor
• Chassis: 1U
• Drive: Up to 16x E3.S Front Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM/LRDIMM in 32 DIMM Slots
• Network Ports: 1x 1GbE RJ45 Dedicated IPMI LAN Port
• Power Supply: 2x 1600W Redundant Titanium Level Power Supplies

• Key Features/Applications: Telecom Micro Data Center, AI Inference and Machine Learning, Cloud Computing, Network Function Virtualization (NFV), 5G Networking
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processor, up to 64 Cores
• Chassis: 2U
• Drive: Up to 6x 2.5" Front Hot-Swap NVMe/SATA Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 Double-Width GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Networking Slots (OCP NIC 3.0 Compatible)
• Power Supply: 2x 2000W Redundant Titanium Level AC Power Supplies

• Key Features/Applications: Virtualization, 5G Core and Edge, Cloud Computing, Software-defined Storage, AI Inference and Machine Learning, Enterprise Server
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 10x 2.5" Front Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Networking Slots (OCP NIC 3.0 Compatible)
• Power Supply: 2x 1200W or 2000W Redundant (1 + 1) Titanium Level AC Power Supplies, or 2x 1300W DC Power Supplies
• Support up to 3x 350W or 2x 600W GPUs

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1000W/1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Climate and Weather Modeling
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 160 Cores
• Chassis: 8U
• Drive: Up to 18x 2.5" Front Hot-Swap NVMe/SATA Drive Bays + 2x M.2 NVMe (M-Key) Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 6x 3000W Redundant (3 + 3) Titanium Level Power Supplies
• Supports AMD Instinct™ MI300X Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, Enterprise Server, Application and data serving, Compute Intensive Applications
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 128 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 4x 3.5" Front Hot-Swap NVMe/SAS/SATA + 4x 3.5" Front Hot-Swap SAS/SATA Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 1200W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Digital-twins, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics, Edge AI Inferencing
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 3U
• Drive: Up to 14x E1.S Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional) or 6x 2.5" Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots (1 DIMM per channel)
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 3x 3200W/2700W Redundant (2 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL, L40S GPU Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: AI / Deep Learning, Visualization / Simulation, 3D Rendering Farm, High Performance Computing, Multimedia/Digital Content Creation
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors, up to 192 Cores/500W TDP
• Chassis: 5U
• Drive: Up to 8x 2.5" Front Hot-Swap NVMe + 2x 2.5" Front Hot-Swap SATA Drive Bays + 1x M.2 NVMe Slots
• RAM: Up to 9TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 2700W (3 + 3) Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

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* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.