AI and Deep Learning

• Key Features/Applications: Virtualization, Software-defined Storage, AI Inference and Machine Learning, Cloud Computing, Enterprise Server
• CPU: Single 5th/4th Gen AMD EPYC™ 9005/9004 Series Processor, up to 128 Cores
• Chassis: 1U
• Drive: Up to 8x 2.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 1 Double-Width GPU
• Network Ports: Flexible Networking Options
• Power Supply: 1200W Redundant Titanium Level Power Supplies
• AMD EPYC™ Turin 9005 Enabled System

• Key Features/Applications: Virtualization, Software-defined Storage, AI Inference and Machine Learning, Cloud Computing, Enterprise Server
• CPU: Single 5th/4th Gen AMD EPYC™ 9005/9004 Series Processors, up to 128 Cores
• Chassis: 2U
• Drive: Up to 12x 3.5"/2.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• GPU: Up to 4 Double-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W Redundant Titanium Level Power Supplies
• AMD EPYC™ Turin 9005 Enabled System

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• Key Features/Applications: Virtualization, AI Inference and Machine Learning, Software-defined Storage, Cloud Computing, Data Center Optimized, AI Inference, Database Processing and High Density Storage
• CPU: Single Intel® Xeon® 6 6700 Series Processors, up to 144 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe*/SAS/SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 1 Double-Width or 2 Single-Width GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies

* Intel Xeon 6700E-series only support 8 NVMe.

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing (HPC), VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging, AI Training
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: Full-Tower/5U Rackmount
• Drive: Up to 8x 3.5" Front Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 4 Double-Width or Single-Width GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 2000W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: High Performance Computing, VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 4U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 4x 2700W Redundant (2 + 2) Titanium Level Power Supplies

• Key Features/Applications: Virtualization, Software-defined Storage, AI Inference and Machine Learning, Cloud Computing, Enterprise Server, High Performance Computing (HPC)
• CPU: Dual AMD EPYC? 9005/9004 Series Processors, up to 384 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SATA Drive Bays
• RAM: Up to 9TB of DDR5 ECC RDIMM in 24 DIMM Slots
• Network Ports: 1x 1GbE RJ45 LAN Ports
• Power Supply: 2x 2000W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: High-Performance File System, Diskless HPC Clusters, Scale Out All-Flash NVMe Storage, Big Data Analytics and AI
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U / 2 Node
• Drive: Up to 12x 2.5" Hot-Swap NVMe/SATA Drive Bays Per Node (2x PCIe 5.0 NVMe/SATA and 10x PCIe 4.0 NVMe/SATA) + 2x M.2 NVMe
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots Per Node
• Cooling: Up to 4 Cooling 16.5K RPM Fans Per 2U Enclosure, Shared Cooling Design Liquid Cooling Support
• Network Ports: Network Connectivity via AIOM (OCP 3.0 Compliant)
• Power Supply: 2x 2200W (1 + 1) Redundant Titanium Level Power Supplies, Shared Power Design