High Performance Computing (HPC)

• Key Features/Applications: AI / Deep Learning, High Performance Computing (HPC), Cloud Gaming, Molecular Dynamics Simulation
• CPU: Dual AMD EPYC™ 7003/7002 Series Processors, up to 128 Cores
• Chassis: 4U
• Drive: Up to 24x 2.5" SAS/SATA Drive Bays
• RAM: Up to 8TB of DDR4 ECC RDIMM/LRDIMM in 32 DIMM Slots
• GPU: Up to 8 GPUs
• Power Supply: 2000W (2+2) Redundant Titanium Level Power Supplies
• Network Ports: 2x 1GbE RJ45 LAN Ports

Important Information: This SKU and/or associated compatible components are approaching End of Life (EOL). To ensure you benefit from a full warranty and ongoing support, we recommend considering other SKUs or contacting us for a product recommendation.

• Key Features/Applications: High Performance Computing, VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 4U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 4x 2700W Redundant (2 + 2) Titanium Level Power Supplies

• Key Features/Applications: High-Performance File System, Diskless HPC Clusters, Scale Out All-Flash NVMe Storage, Big Data Analytics and AI
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U / 2 Nodes
• Drive: Up to 12x 2.5" Hot-Swap NVMe/SATA Drive Bays Per Node (2x PCIe 5.0 NVMe/SATA and 10x PCIe 4.0 NVMe/SATA) + 2x M.2 NVMe
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots Per Node
• Cooling: Up to 4 Cooling 16.5K RPM Fans Per 2U Enclosure, Shared Cooling Design Liquid Cooling Support
• Network Ports: Network Connectivity via AIOM (OCP 3.0 Compliant)
• Power Supply: 2x 2200W (1 + 1) Redundant Titanium Level Power Supplies, Shared Power Design

* Complete systems only with all 2 nodes populated.

• Key Features/Applications: AI / Deep Learning, VDI, Design & Visualization, 3D Rendering, High Performance Computing, Media/Video Streaming, Cloud Gaming, Diagnostic Imaging
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 5U
• Drive: Up to 24x 2.5" Front Hot-Swap PCIe 5.0 NVMe Drive Bays + 2x M.2 NVMe Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 2700W Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging
• CPU: Dual 4th Gen Intel® Xeon® Scalable Processors, up to 60 Cores
• Chassis: 5U
• Drive: Up to 24x 2.5" Hot-Swap NVMe/SATA/SAS Drive Bays
• RAM: Up to 8TB of DDR5 ECC DRAM in 32 DIMM Slots
• GPU: Up to 10 GPUs
• Power Supply: 4x 2700W (2+2) Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, AI Inference and Machine Learning, Software-defined Storage, Cloud Computing, Data Center Optimized, AI Inference, Database Processing and High Density Storage
• CPU: Single Intel® Xeon® 6 6521P Processor, 24 Cores
• Chassis: 2U
• Drive: 1x 960GB M.2 NVMe SSD
• RAM: 1x 32GB DDR5-6400 ECC RDIMM Memory
• Network Ports: 2x 10GbE RJ45 LAN Ports via AIOM
• Need more customization? Explore the configurable SYS-212H-TN system.