Solutions

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Digital-twins, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics, Edge AI Inferencing
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 3U
• Drive: Up to 14x E1.S Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional) or 6x 2.5" Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots (1 DIMM per channel)
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 3x 3200W/2700W Redundant (2 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL, L40S GPU Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing (HPC), AI/Deep Learning Training, Machine Learning (ML), Climate and Weather Modeling, Database Processing and High Density Storage, Industrial Automation Retail, Data Center
• CPU: Dual AMD EPYC™ 9575F Processors, 64 Cores
• Chassis: 8U
• Drive: 1x 960GB U.2 NVMe SSD + 4x 3.8TB U.3 NVMe SSD
• RAM: 24x 96GB DDR5-6400 ECC RDIMM Memory
• GPU: 8x AMD Instinct™ MI325X Onboard OAM GPUs
• Network Ports: 8x Single Port 400GbE QSFP112 Ports
• Power Supply: 6x 5250W Redundant (3 + 3) Titanium Level Power Supplies
• Pre-Configured AMD Instinct™ MI325X 8-GPU System

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.