AI and Deep Learning

• Key Features/Applications: High Performance Computing (HPC), AI/Deep Learning Training, Machine Learning (ML), Climate and Weather Modeling, Database Processing and High Density Storage, Industrial Automation Retail, Data Center
• CPU: Dual AMD EPYC™ 9575F Processors, 64 Cores
• Chassis: 8U
• Drive: 1x 960GB U.2 NVMe SSD + 4x 3.8TB U.3 NVMe SSD
• RAM: 24x 96GB DDR5-6400 ECC RDIMM Memory
• GPU: 8x AMD Instinct™ MI325X Onboard OAM GPUs
• Network Ports: 8x Single Port 400GbE QSFP112 Ports
• Power Supply: 6x 5250W Redundant (3 + 3) Titanium Level Power Supplies
• Pre-Configured AMD Instinct™ MI325X 8-GPU System

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: AI / Deep Learning, Conversational AI, High Performance Computing (HPC), Scientific Research, Drug Discovery
• CPU: Dual Intel® Xeon® 6960P Processors, 72 Cores
• Chassis: 10U
• Drive: 2x 1.9TB M.2 NVMe SSD + 4x 1.9TB U.2 NVMe SSD
• RAM: 24x 96GB DDR5-6400 ECC RDIMM Memory
• GPU: 8x NVIDIA HGX™ B200 GPUs
• DPU: 1x NVIDIA BlueField®-3 DPU 200Gb/s
• Network Ports: 8x 400GbE NDR/ETH OSFP + 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 5250W Redundant (3 + 3) Titanium Level Power Supplies
• Pre-Configured NVIDIA HGX™ B200 8-GPU System

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Cloud Computing, Network Appliance, Database/Storage, Data Center Optimized, AI Inferencing, ML Training
• CPU: Single 5th Gen Intel® Xeon® 4510 Processor, 12 Cores
• Chassis: 2U
• Drive: 2x 960GB M.2 NVMe SSD
• RAM: 2x 64GB DDR5-5600 ECC RDIMM Memory
• Network Ports: 2x 10GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1200W Redundant (1 + 1) Titanium Level Power Supplies
• Need more customization? Explore the configurable SYS-521C-NR system.

• Key Features/Applications: Virtualization, AI Inference and Machine Learning, Software-defined Storage, Cloud Computing, Data Center Optimized, AI Inference, Database Processing and High Density Storage
• CPU: Single Intel® Xeon® 6 6521P Processor, 24 Cores
• Chassis: 2U
• Drive: 1x 960GB M.2 NVMe SSD
• RAM: 1x 32GB DDR5-6400 ECC RDIMM Memory
• Network Ports: 2x 10GbE RJ45 LAN Ports via AIOM
• Need more customization? Explore the configurable SYS-212H-TN system.

• Key Features/Applications: High Performance Computing, Conversational AI, AI/Deep Learning Training, Business Intelligence & Analytics, Industrial Automation
• CPU: Dual 5th Gen Intel® Xeon® Platinum 8570 Processor, 56 Cores
• Chassis: 10U
• Drive: 8x 3.8TB U.3 NVMe SSD + 2x 1.92TB M.2 NVMe SSD
• RAM: 32x 96GB DDR5-5600 ECC RDIMM Memory
• GPU: 8x NVIDIA HGX™ B200 GPUs
• DPU: 1x NVIDIA BlueField®-3 DPU 200Gb/s
• Network Ports: 8x 400GbE NDR/ETH OSFP + 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 5250W Redundant (3 + 3) Titanium Level Power Supplies
• Pre-Configured NVIDIA HGX™ B200 8-GPU System

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 8U
• Drive: Up to 19x 2.5" Front Hot-Swap NVMe/SATA Drive Bays + 2x M.2 NVMe Slots
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 8 Double-Wide GPUs
• Network Ports: Flexible Networking Options
• Power Supply: 6x 3000W Redundant (3 + 3) Titanium Level Power Supplies
• NVIDIA Certified System. Supports NVIDIA HGX™ H200 8-GPU
• Success Story: Building Massive AI Cloud Scalable Infrastructure for Advanced AI Training

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: 5G Core and Edge, Network Function Virtualization, AI Inference and Machine Learning, Cloud Computing, Short-depth Server, Design with compliance to NEBS-Level 3
• CPU: Single 5th/4th Gen Intel® Xeon® Scalable Processor, up to 60 Cores
• Chassis: 2U
• Drive: Up to 2x 2.5" Front Hot-Swap NVMe Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 800W Redundant Platinum Level AC Power Supplies

Lot 9 Compliance Notice: This product is exempt from Lot 9 requirements in accordance with relevant regulations. Before purchasing, please ensure the equipment type or your intended use for this product aligns with the Lot 9 exemption criteria.

Please find the details here.

• Key Features/Applications: 5G Core and Edge, Network Function Virtualization, AI Inference and Machine Learning, Cloud Computing, Short-depth Server, Design with compliance to NEBS-Level 3
• CPU: Single 5th/4th Gen Intel® Xeon® Scalable Processor, up to 60 Cores
• Chassis: 2U
• Drive: Up to 2x 2.5" Front Hot-Swap NVMe Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 600W Redundant Typical 90%+ Level (96%) DC-48V Power Supplies

Lot 9 Compliance Notice: This product is exempt from Lot 9 requirements in accordance with relevant regulations. Before purchasing, please ensure the equipment type or your intended use for this product aligns with the Lot 9 exemption criteria.

Please find the details here.

• Key Features/Applications: Virtualization, AI Inferencing & Machine Learning, Enterprise Server, Software-Defined Storage, Cloud Computing, High Performance Computing (HPC)
• CPU: Dual AMD EPYC™ 9005/9004 Series Processors
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SATA Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM in 24 DIMM Slots
• Network Ports: Flexible Networking Options with 1 AIOM Networking Slot (OCP NIC 3.0 compatible)
• Power Supply: 2x 1600W/2000W/2600W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Multi-Access Edge Computing (MEC), Industrial Automation, Machine Learning (ML), Universal Customer Premise Equipment (uCPE), Artificial Intelligence at the Edge, Smart Retail, Medical Expert Systems
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 48 Cores (P-cores)/144 Cores (E-cores)
• Chassis: Fan-based Embedded
• Drive: Up to 2x 2.5" Front Hot-Swap NVMe + 2x 2.5" Internal Fixed SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 2x GPUs Single-Width or 1x GPU Double-Width (up to 350W)
• Network Ports: 2x 10GbE RJ45 LAN Ports

Lot 9 Compliance Notice: This product is exempt from Lot 9 requirements in accordance with relevant regulations. Before purchasing, please ensure the equipment type or your intended use for this product aligns with the Lot 9 exemption criteria.

Please find the details here.