SuperWorkstation

• Key Features/Applications: Entry-Level System, Designed for Small and Medium-sized Business Applications
• CPU: Single Intel® Xeon® E-2400 Series Processors or 12th Generation Pentium® Processors, up to 8 Cores
• Chassis: Compact Mini-Tower
• Drive: Up to 4x 3.5" Front Hot-Swap PCIe 4.0 x4 NVMe/SAS/SATA Drive Bays. (NVMe/SAS Optional)
• RAM: Up to 64GB of DDR5 ECC UDIMM in 2 DIMM Slots
• Network Ports: 2x 1GbE RJ45 LAN Ports

• Key Features/Applications: Storage, Application and Centralized Data Backup System Applications, IPMI for Remote Management, Entry-Level Server for SOHO and SMB
• CPU: Single Intel® Xeon® E-2400 Series Processors or 12th Generation Pentium® Processors, up to 8 Cores
• Chassis: Mini-Tower
• Drive: Up to 4x 3.5" Internal SATA Drive Bays
• RAM: Up to 128GB of DDR5 ECC UDIMM in 4 DIMM Slots
• Network Ports: 2x 1GbE RJ45 LAN Ports

• Key Features/Applications: Rendering, CAD, Multimedia/Digital Content Creation, Engineering/Scientific Research
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 350W TDP
• Chassis: Full-Tower/5U Rackmount
• Drive: Up to 4x Internal 3.5"/2.5” Easy-Swap SATA + 2x Front 2.5" Easy-Swap SATA + 2x 5.25" Peripheral Drive Bays (Optional)
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 2 Double-Width GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2000W Platinum Level Power Supplies

• Key Features/Applications: Product Design and Engineering Simulation
• CPU: Single Intel® Xeon® W-3400 Processor, up to 56 Cores
• Chassis: Full-Tower / 5U Rackmount
• Drive: Up to 4x 3.5" SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM/LRDIMM in 16 DIMM Slots
• GPU: Up to 1 Triple-Width or 4 Double-Width or 6 Single-Width GPUs
• Power Supply: 2000W Redundant Platinum Level Power Supplies
• Network Ports: 1x 10GbE RJ45 LAN Ports

• Key Features/Applications: 2D/3D Content Creation, VR Content Development
• CPU: Single Intel® Xeon® W-2400 Processor, up to 24 Cores
• Chassis: Mid-Tower
• Drive: Up to 4x 3.5" SATA + 2x M.2 NVMe Drive Bays
• RAM: Up to 1TB of DDR5 ECC RDIMM/LRDIMM in 8 DIMM Slots
• Network Ports: 1x 1GbE RJ45 + 1x 10GbE RJ45 LAN Ports

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: CAD/3D Modeling, 2D/3D Content Creation, VR Content Development
• CPU: Single 12th Gen Intel® Core™ i Processor, up to 24 Cores
• Chassis: Mid-Tower
• Drive: Up to 4x 3.5" SATA + 3x M.2 NVMe Drive Bays. Supports up to 4x 2.5" SATA Drive Bays (Optional)
• RAM: Up to 128GB of DDR5 ECC UDIMM in 4 DIMM Slots
• Network Ports: 1x 1GbE RJ45 + 1x 2.5GbE RJ45 LAN Ports
• Contact Us if you would like to configure your own system

• Key Features/Applications: Deep Learning, AI, Machine Learning Development
• CPU: Single 3rd Gen Intel® Xeon® Scalable Processor, up to 40 Cores
• Chassis: Full-Tower
• Drive: Up to 8x 3.5" Hot-Swap SATA + 4x M.2 NVMe/PCIe Drive Bays + 3x 5.25" Peripheral Drive Bays
• RAM: Up to 4TB of DDR4 ECC RDIMM/LRDIMM in 16 DIMM Slots
• Network Ports: 1x 10GbE + 1x 1GbE + 1x 1GbE Dedicated IPMI LAN Ports

• Key Features/Applications: Entry-Level System for SOHO/SMB, Storage, and Centralized Data Backup Systems
• CPU: Single Intel® Xeon® E-2300 Series Processor, up to 8 Cores
• Chassis: Mini-Tower
• Drive: Up to 4x 3.5" SATA + 1x M.2 NVMe Drive Bays
• RAM: Up to 128GB of DDR4 ECC UDIMM in 4 DIMM Slots
• Network Ports: 2x 1GbE RJ45 LAN Ports

• Key Features/Applications: Media/Entertainment Content Creation, Product Design, Engineering Simulation, AI/Deep Learning
• CPU: Single AMD Ryzen™ Threadripper™ PRO 5000WX/3000WX Series Processor, up to 64 Cores
• Chassis: Full Tower
• Drive: Up to 4x 2.5"/3.5" SATA + 2x 2.5" SATA + 4x M.2 NVMe Drive Bays
• RAM: Up to 2TB of DDR4 ECC RDIMM in 8 DIMM Slots
• Network Ports: 1x 10GbE RJ45 LAN Ports
• GPU: Up to 4 GPUs, Support NVIDIA RTX 6000 Ada Generation Graphics Card

• Key Features/Applications: Rendering, CAD, Multimedia/Digital Content Creation, Engineering/Scientific Research
• CPU: Dual 3rd Gen Intel® Xeon® Scalable Processors, up to 40 Cores
• Chassis: 4U Tower
• Drive: Up to 8x 3.5" Hot-Swap SATA + 2x M.2 NVMe Drive Bays. Supports up to 3x 5.25" Peripheral Drive Bays (Optional)
• RAM: Up to 3TB of DDR4 ECC RDIMM/LRDIMM in 16 DIMM Slots
• Network Ports: 2x 1GbE RJ45 LAN Ports