X14 Systems

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 72 Cores
• Chassis: 4U
• Drive: Up to 8x E1.S Front Hot-Swap NVMe Drive Bays
• RAM: Up to 6TB of DDR5 ECC RDIMM (6400MT/s) or ECC MRDIMM (8800MT/s) in 24 DIMM Slots
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GBASE-T RJ45 LAN Ports
• Power Supply: 4x 3200W Redundant (3 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1000W/1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Enterprise AI, Chatbot/RAG, Document Processing, Content Creation, Recommendation, Synthetic Data Generation, Agentic AI, LLM/VLM finetuning/training, HPC, CAD/CAE/CFD, Scientific Research (Modular Dynamics, Weather Forecast, Geological Analysis)
• CPU: Dual Intel® Xeon® 6960P Processor, 72 Cores Per CPU
• Chassis: 4U
• Drive: 1x 960GB M.2 PCIe Gen 4.0 NVMe + 2x 3.8TB U.2 PCIe Gen 4.0 NVMe SSD
• RAM: 16x 64GB DDR5-6400 RDIMM Memory
• GPU: 4x NVIDIA RTX PRO™ 6000 Blackwell Server Edition GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports (Intel X710-AT2)
• Power Supply: 4x 3200W Redundant Titanium Level Power Supplies
• Pre-Configured Agent Flow AI Inferencing System (PaaS) View Datasheet

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, 5G Core and Edge, Cloud Computing, Software-defined Storage, AI Inference and Machine Learning, Enterprise Server
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 10x 2.5" Front Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Networking Slots (OCP NIC 3.0 Compatible)
• Power Supply: 2x 1200W or 2000W Redundant (1 + 1) Titanium Level AC Power Supplies, or 2x 1300W DC Power Supplies
• Support up to 3x 350W or 2x 600W GPUs

• Key Features/Applications: Large-Scale AI Inference Serving
• CPU: Dual Intel® Xeon® 6768P Processors, 128 Cores
• Chassis: 8U
• Drive: 1x 960GB M.2 NVMe SSD
• RAM: 16 x 128GB DDR5-6400 Memory
• GPU: NVIDIA HGX™ B300 8-GPU
• Network Ports: 1x 8-Port 800GbE/XDR800
• Power Supply: 2x 6600W Redundant (1 + 1) Titanium Level Power Supplies
• Pre-Configured DP 8U System with NVIDIA HGX B300 8-GPU. View Datasheet

* Please note that Onsite Service is required, and pricing may vary based on your service location. Please contact us before purchasing this server.

* Orders are subject to review and require verification prior to shipping. We reserve the right to cancel any order at our discretion.

* Estimated lead time is currently 2-3 weeks post-verification. Actual delivery schedule will depend on quantity and availability.

• Best for: Virtualization & Private Cloud Consolidation
• Key Features/Applications: High Performance Computing (HPC), Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual Intel® Xeon® 6740P Processors, 48 Cores
• Chassis: 2U
• Drive: 2x 3.8TB U.2 NVMe SSD
• RAM: 16x 64GB DDR5-6400 RDIMM Memory
• Network Ports: 2x 25GbE SFP28 LAN Ports
• Power Supply: 2x 2000W Redundant Titanium Level Power Supplies
• Need more customization? Explore the configurable SYS-222H-TN system.

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: AI / Deep Learning, VDI, Design & Visualization, 3D Rendering, High Performance Computing, Media/Video Streaming, Cloud Gaming, Diagnostic Imaging
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 5U
• Drive: Up to 24x 2.5" Front Hot-Swap PCIe 5.0 NVMe Drive Bays + 2x M.2 NVMe Slots
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots
• GPU: Up to 10 GPUs
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 6x 2700W Redundant Titanium Level Power Supplies
• Supports NVIDIA H200 NVL or RTX PRO™ 6000 Blackwell Server Edition PCIe 5.0 Graphics Cards

* Estimated lead time is currently 6-8 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: High Performance Computing, AI/Deep Learning Training, Digital-twins, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics, Edge AI Inferencing
• CPU: Dual Intel® Xeon® 6900 Series Processors with P-cores, up to 128 Cores/500W TDP
• Chassis: 3U
• Drive: Up to 14x E1.S Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional) or 6x 2.5" Front Hot-Swap PCIe 5.0 x4 NVMe Drive Bays (Optional)
• RAM: Up to 6TB of DDR5 ECC RDIMM/MRDIMM in 24 DIMM Slots (1 DIMM per channel)
• GPU: Up to 8 GPUs
• Network Ports: 1x 1GbE RJ45 Dedicated BMC LAN Ports
• Power Supply: 3x 3200W/2700W Redundant (2 + 1) Titanium Level Power Supplies
• Supports NVIDIA H200 NVL, L40S GPU Cards

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Virtualization, Enterprise Server, Application and data serving, Compute Intensive Applications
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 128 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 4x 3.5" Front Hot-Swap NVMe/SAS/SATA + 4x 3.5" Front Hot-Swap SAS/SATA Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 1200W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.