Networking

• Key Features/Applications: Telecom Micro Data Center, AI Inference and Machine Learning, Cloud Computing, Network Function Virtualization (NFV), 5G Networking
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processor, up to 64 Cores
• Chassis: 2U
• Drive: Up to 6x 2.5" Front Hot-Swap NVMe/SATA Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 Double-Width GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Networking Slots (OCP NIC 3.0 Compatible)
• Power Supply: 2x 2000W Redundant Titanium Level AC Power Supplies

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Generative AI, AI Inference, Model Training, 3D Graphics and Video Rendering, Cloud Gaming
• CPU: Single AMD EPYC™ 4005/4004 Series Processor Per Node, up to 16 Cores
• Chassis: 3U / 5 Nodes
• Drive: Up to 2x 2.5" Internal Fixed PCIe 5.0 NVMe + 2x 2.5" Internal Fixed SATA Drive Bays Per Node
• RAM: Up to 192GB of DDR5 ECC/non-ECC UDIMM in 4 DIMM Slots Per Node
• GPU: Up to 2 GPUs Per Node
• Network Ports: Flexible Networking Options with PCIe 5.0 MicroLP Interfaces
• Power Supply: 4x 2000W Redundant (3 + 1) Titanium Level Shared Power Supply

* Complete systems only with all 5 nodes populated.