Networking

• Key Features/Applications: Web/Hosting Application, Encoding Decoding, Database Processing and Storage
• CPU: Single Intel® Xeon® 6300/E-2400/Pentium® G7400/G7400T Processor, up to 8 Cores
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap SATA/SAS Drive Bays
• RAM: Up to 128GB of DDR5 ECC UDIMM in 4 DIMM Slots
• Network Ports: 2x 1GbE RJ45 LAN Ports
• Power Supply: 1x 600W Titanium Level Power Supply

Important Information: This SKU and/or associated compatible components are approaching End of Sale (EOS). To ensure you benefit from a full warranty and ongoing support, we recommend considering other SKUs or contacting us for a product recommendation.

• Key Features/Applications: 5G Core and Edge, AI Inference and Machine Learning, Network Function Virtualization (NFV), Cloud Computing
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 144 Cores
• Chassis: 2U
• Drive: Up to 2x 2.5" Front Hot-Swap PCIe 5.0 NVMe Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 2x 10GbE RJ45 + 2x 10GbE SFP+ LAN Ports
• Power Supply: 2x 800W Redundant (1 + 1) Titanium Level Power Supplies
• NEBS-Level 3 Compliant

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1000W/1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Multi-Access Edge Computing (MEC), Flex-RAN, Open-RAN vBBU, Artificial Intelligence (AI) on Edge, DU of 5G Application, Satellite Communication
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 144 Cores
• Chassis: 1U
• Drive: Up to 2x 2.5" Internal Fixed NVMe/SATA Drive Bays
• RAM: Up to 1TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 1 GPU
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 800W Redundant (1 + 1) Titanium Level Power Supplies