Servers

• Key Features/Applications: Hyperconverged Infrastructure, Container Storage, Scale-Out File Server
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U / 4 Node
• Drive: Up to 3x 3.5" Hot-Swap NVMe/SATA Drive Bays Per Node (2x PCIe 5.0 NVMe/SATA and 1x PCIe 4.0 NVMe/SATA) + 2x M.2 NVMe
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots Per Node
• Cooling: Up to 4 Cooling 14.9K RPM Fans Per 2U Enclosure, Shared Cooling Design Liquid Cooling Support
• Network Ports: Network Connectivity via AIOM (OCP 3.0 Compliant)
• Power Supply: 2x 3000W (1 + 1) Redundant Titanium Level Power Supplies, Shared Power Design

• Key Features/Applications: High-Performance File System, Diskless HPC Clusters, Scale Out All-Flash NVMe Storage, Big Data Analytics and AI
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U / 2 Nodes
• Drive: Up to 12x 2.5" Hot-Swap NVMe/SATA Drive Bays Per Node (2x PCIe 5.0 NVMe/SATA and 10x PCIe 4.0 NVMe/SATA) + 2x M.2 NVMe
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots Per Node
• Cooling: Up to 4 Cooling 16.5K RPM Fans Per 2U Enclosure, Shared Cooling Design Liquid Cooling Support
• Network Ports: Network Connectivity via AIOM (OCP 3.0 Compliant)
• Power Supply: 2x 2200W (1 + 1) Redundant Titanium Level Power Supplies, Shared Power Design

* Complete systems only with all 2 nodes populated.

• Key Features/Applications: All-Flash NVMe Hyperconverged Infrastructure, Container-as-a-Service; Application Accelerator, High-Performance File System, Diskless HPC Clusters
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U / 4 Nodes
• Drive: Up to 6x 2.5" Hot-Swap NVMe/SATA Drive Bays Per Node (2x PCIe 5.0 NVMe/SATA and 4x PCIe 4.0 NVMe/SATA) + 2x M.2 NVMe
• RAM: Up to 4TB of DDR5 ECC RDIMM in 16 DIMM Slots Per Node
• Cooling: Up to 4 Cooling 16K RPM Fans Per 2U Enclosure, Shared Cooling Design, Counter-Rotating Liquid Cooling Support
• Network Ports: Network Connectivity via AIOM (OCP 3.0 Compliant)
• Power Supply: 2x 3000W (1 + 1) Redundant Titanium Level Power Supplies, Shared Power Design

* Complete systems only with all 4 nodes populated.

• Key Features/Applications: Virtualization, Software-defined Storage, AI Inference and Machine Learning, Cloud Computing, Enterprise Server
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors, up to 64 Cores
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays (Optional)
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Networking Slots (OCP NIC 3.0 compatible)
• Power Supply: 2x 1600W Redundant Titanium Level Power Supplies

• Key Features/Applications: Virtualization, Enterprise Server, Application and data serving, Compute Intensive Applications
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 128 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 4x 3.5" Front Hot-Swap NVMe/SAS/SATA + 4x 3.5" Front Hot-Swap SAS/SATA Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• Network Ports: 2x 10GbE RJ45 LAN Ports
• Power Supply: 2x 1200W Redundant (1 + 1) Titanium Level Power Supplies

* Estimated lead time is currently 8-10 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Virtualization, 5G Core and Edge, Cloud Computing, Software-defined Storage, AI Inference and Machine Learning, Enterprise Server
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 10x 2.5" Front Hot-Swap NVMe Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Networking Slots (OCP NIC 3.0 Compatible)
• Power Supply: 2x 1200W or 2000W Redundant (1 + 1) Titanium Level AC Power Supplies, or 2x 1300W DC Power Supplies
• Support up to 3x 350W or 2x 600W GPUs

• Key Features/Applications: Telecom Micro Data Center, AI Inference and Machine Learning, Cloud Computing, Network Function Virtualization (NFV), 5G Networking
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processor, up to 64 Cores
• Chassis: 2U
• Drive: Up to 6x 2.5" Front Hot-Swap NVMe/SATA Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 Double-Width GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Networking Slots (OCP NIC 3.0 Compatible)
• Power Supply: 2x 2000W Redundant Titanium Level AC Power Supplies

• Best for: Virtualization & Private Cloud Consolidation
• Key Features/Applications: AI Inferencing & Machine Learning, Enterprise Server, Software-Defined Storage, Cloud Computing, High Performance Computing (HPC)
• CPU: Dual AMD EPYC™ 9965 Processors, 192 Cores
• Chassis: 2U
• Drive: 2x 960GB M.2 NVMe SSD
• RAM: 24x 64GB DDR5-6400 RDIMM Memory
• Network Ports: 2x 25GbE SFP28 LAN Ports
• Power Supply: 2x 2000W Redundant Titanium Level Power Supplies
• Need more customization? Explore the configurable AS -2126HS-TN system.

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.

• Best for: Virtualization & Private Cloud Consolidation
• Key Features/Applications: High Performance Computing (HPC), Enterprise Server, Software-Defined Storage, Cloud Computing
• CPU: Dual Intel® Xeon® 6740P Processors, 48 Cores
• Chassis: 2U
• Drive: 2x 3.8TB U.2 NVMe SSD
• RAM: 16x 64GB DDR5-6400 RDIMM Memory
• Network Ports: 2x 25GbE SFP28 LAN Ports
• Power Supply: 2x 2000W Redundant Titanium Level Power Supplies
• Need more customization? Explore the configurable SYS-222H-TN system.

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.