Cloud Computing

• Key Features/Applications: Generative AI, AI Inference, Model Training, 3D Graphics and Video Rendering, Cloud Gaming
• CPU: Single AMD EPYC™ 4005/4004 Series Processor Per Node, up to 16 Cores
• Chassis: 3U / 5 Nodes
• Drive: Up to 2x 2.5" Internal Fixed PCIe 5.0 NVMe + 2x 2.5" Internal Fixed SATA Drive Bays Per Node
• RAM: Up to 192GB of DDR5 ECC/non-ECC UDIMM in 4 DIMM Slots Per Node
• GPU: Up to 2 GPUs Per Node
• Network Ports: Flexible Networking Options with PCIe 5.0 MicroLP Interfaces
• Power Supply: 4x 2000W Redundant (3 + 1) Titanium Level Shared Power Supply

* Complete systems only with all 5 nodes populated.

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 12x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1000W/1200W/1600W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Virtualization, HPC, CDN, Edge Nodes, Cloud Computing, Data Center Optimized, Storage Headnode
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 8x 2.5" Front Hot-Swap PCIe 5.0 NVMe/SAS/SATA Drive Bays + 4x 2.5" PCIe 5.0 SAS/SATA Drive Bays (Optional)
• RAM: Up to 2TB of DDR5 ECC RDIMM in 16 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: Flexible Networking Options with 2 PCIe 5.0 slots + 1 AIOM Networking Slot
• Power Supply: 2x 1000W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) with Flexible I/O and Storage Configurations
• Based on Modular Scalable DeNsity Optimized HPM Form Factor (M-SDNO)
• Supports DC-SCM module with OpenBMC

• Key Features/Applications: Telecom Micro Data Center, AI Inference and Machine Learning, Cloud Computing, Network Function Virtualization (NFV), 5G Networking
• CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processor, up to 64 Cores
• Chassis: 2U
• Drive: Up to 6x 2.5" Front Hot-Swap NVMe/SATA Drive Bays
• RAM: Up to 8TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 3 Double-Width GPUs
• Network Ports: Flexible Networking Options with up to 2 AIOM Networking Slots (OCP NIC 3.0 Compatible)
• Power Supply: 2x 2000W Redundant Titanium Level AC Power Supplies

• Key Features/Applications: Virtualization, Data Center Optimized, Edge/Cloud Computing Services, Database/Storage, Firewall Applications
• CPU: Single AMD EPYC™ 8004 Series Processor, up to 64 Cores
• Chassis: 1U
• Drive: Up to 4x 3.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 768GB of DDR5 ECC RDIMM in 6 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: 2x 10GBase-T RJ45 LAN Ports
• Power Supply: 2x 860W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: Virtualization, Cloud Computing, Data Center Optimized, Database/Storage, Storage Headnode, Web Cache, CDN, Video Streaming, AI Inference, Networking Security Appliance, Entry-Level System for SOHO and SMB, Entry GPU Server
• CPU: Single Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 1U
• Drive: Up to 10x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 2TB of DDR5 ECC RDIMM in 8 DIMM Slots
• GPU: Up to 2 GPUs
• Network Ports: 2x 1GbE RJ45 LAN Ports
• Power Supply: 2x 860W Redundant (1 + 1) Titanium Level Power Supplies

• Key Features/Applications: In-Memory Database for AI Inferencing
• CPU: Single AMD EPYC™ 9655P Processor, 96 Cores
• Chassis: 2U
• Drive: 2x 7.6TB U.2 NVMe SSD
• RAM: 24x 64GB DDR5-4000 RDIMM Memory
• Network Ports: 1x NVIDIA® BlueField®-3 B3220 DPU 200GbE Dual Port
• Power Supply: 2x 1600W Redundant (1 + 1) Titanium Level Power Supplies
• Need more customization? Explore the configurable AS -2115HS-TNR system.

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Storage Hardware for IaaS
• CPU: Single AMD EPYC™ 9455P Processor, 48 Cores
• Chassis: 2U
• Drive: 8x 24TB 3.5" SATA + 2x 3.8TB U.2 NVMe + 2x 240GB 2.5" SATA SSD
• RAM: 12x 64GB DDR5-6400 RDIMM Memory
• Network Ports: 2x 25GbE SFP28 LAN Ports (Broadcom 57414)
• Power Supply: 2x 1200W Redundant (1 + 1) Titanium Level Power Supplies
• Need more customization? Explore the configurable AS -2015CS-TNR system.

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Hosting & Cloud Gaming
• CPU: Single AMD EPYC™ 4565P Processor, 16 Cores
• Chassis: 3U / 8 Nodes
• Drive: 2x 1.92TB U.2 NVMe SSD Per Node
• RAM: 2x 32GB DDR5-5600 UDIMM Memory Per Node
• Network Ports: 2x 10GbE/25GbE SFP28 LAN Ports Per Node
• Power Supply: 2x 2200W Titanium Level Power Supply
• Pre-Configured 3U 8-Node MicroCloud System with Single-Width GPU Support. View Datasheet

* Estimated lead time is currently 2-3 weeks. Actual delivery schedule will depend on quantity and availability.

• Key Features/Applications: Data Center Optimized, Value IaaS, Cloud Computing, HPC, Data Center, Private & Hybrid Cloud, Cloud Solution Provider (CSP), Networking Security Appliance
• CPU: Dual Intel® Xeon® 6700/6500 Series Processors with P-cores or 6700 Series Processors with E-cores, up to 86 Cores (P-cores)/144 Cores (E-cores)
• Chassis: 2U
• Drive: Up to 24x 2.5" Front Hot-Swap NVMe/SAS/SATA Drive Bays
• RAM: Up to 4TB of DDR5 ECC RDIMM in 32 DIMM Slots
• GPU: Up to 4 GPUs
• Network Ports: 1x 1GbE RJ45 LAN Ports via AIOM
• Power Supply: 2x 1600W/2000W/2200W/3200W Redundant (1 + 1) Titanium Level Power Supplies
• All-in-one Platform for Cloud Data Centers. Based on the OCP Data Center Modular Hardware System (DC-MHS) to Simplify CSP Deployments and Serviceability
• Supports DC-SCM module with OpenBMC